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VD0623 Copper Indium Evaporation Materials, Cu/In

Catalog No.VD0623
MaterialCopper Indium (Cu/In)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM excels in the production of high-purity copper indium evaporation materials, employing rigorous quality assurance processes to ensure the reliability of our products. We offer these materials in various forms, including tablets, granules, pellets, and powders, catering to diverse application needs.

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Overview of Copper Indium Evaporation Materials

TFM offers premium copper indium evaporation materials, an alloy comprised of copper (Cu) and indium (In) designed to deliver high-purity performance. Our copper indium materials are critical in deposition processes, ensuring the creation of high-quality deposited films. With purity levels reaching up to 99.9995%, our products are manufactured using stringent quality assurance protocols to guarantee exceptional reliability.

Related Products: Copper Evaporation Materials, Indium Evaporation Materials

Applications of Copper Indium Evaporation Materials

Copper indium evaporation materials are integral to several high-tech applications:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Uses: Ideal for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our copper indium evaporation materials are meticulously handled to prevent damage and maintain product integrity during storage and transportation. We ensure that the materials arrive in optimal condition.

Contact TFM for Copper Indium Evaporation Materials

As a leading supplier of high-purity copper indium evaporation materials, TFM provides a range of products including powders and granules. We also offer customized forms to meet specific requirements. For current pricing and to inquire about other deposition materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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