Copper Manganese Nickel Sputtering Target
Introduction
The Copper Manganese Nickel (CuMnNi) Sputtering Target is a multi-component alloy designed for advanced thin film deposition applications. By combining the excellent electrical and thermal conductivity of copper with the strength and corrosion resistance of manganese and nickel, this sputtering target provides superior performance for both functional and decorative coatings. Its adaptability makes it suitable for a wide range of industries, including electronics, semiconductors, optics, and energy.
Detailed Description
The CuMnNi sputtering target is engineered with controlled alloy compositions to achieve a balance of conductivity, durability, and chemical resistance.
Copper (Cu): Ensures high conductivity and excellent adhesion.
Manganese (Mn): Enhances corrosion resistance and contributes to hardness.
Nickel (Ni): Improves mechanical strength, wear resistance, and thermal stability.
Produced via powder metallurgy or vacuum melting, the targets are manufactured with uniform density and low impurity levels (purity ≥99.9%). They are available in standard and custom dimensions to match different sputtering systems. Optional bonding with copper, indium, or elastomer backplates ensures stable operation under high-power sputtering conditions.
Applications
The Copper Manganese Nickel sputtering target is widely used in:
Semiconductors: Barrier and conductive films in integrated circuits.
Magnetic recording media: Thin film deposition for data storage technologies.
Optical coatings: Anti-reflective and functional films for precision optics.
Energy applications: Thin films for batteries, fuel cells, and solar cells.
Decorative coatings: Uniform metallic finishes with enhanced durability.
Research & Development: Alloy thin film studies and material property investigations.
Technical Parameters
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Purity | ≥99.9% | Reduces contamination in films |
| Diameter | 25 – 300 mm (custom) | Compatible with different sputtering systems |
| Thickness | 3 – 6 mm | Influences deposition rate and target life |
| Density | ~8.0 g/cm³ (alloy-dependent) | Ensures consistent sputtering |
| Bonding | Indium, Copper, Elastomer | Enhances thermal conductivity and target stability |
Comparison with Related Materials
| Material | Key Advantage | Typical Application |
|---|---|---|
| Copper Manganese Nickel | Balanced conductivity & corrosion resistance | Electronics, coatings |
| Copper Nickel (CuNi) | Strong corrosion resistance | Marine & electronic films |
| Copper Manganese (CuMn) | High wear resistance | Thin films for durability |
FAQ
| Question | Answer |
|---|---|
| Can the CuMnNi sputtering target be customized? | Yes, alloy ratios, dimensions, and bonding methods can be tailored. |
| How are these targets packaged? | They are vacuum-sealed, protected with foam, and shipped in export-safe cartons or wooden crates. |
| What industries use CuMnNi targets most? | Semiconductor, optics, energy, decorative coating, and R&D. |
| Do you supply bonded targets? | Yes, backing with indium, copper, or elastomer is available. |
Packaging
Each Copper Manganese Nickel sputtering target is meticulously labeled, vacuum-sealed, and cushioned with protective materials. Export-safe packaging, including sturdy cartons or wooden crates, ensures safe handling and transportation worldwide.
Conclusion
The Copper Manganese Nickel Sputtering Target offers a reliable solution for industries requiring advanced thin film coatings with excellent durability, corrosion resistance, and conductivity. With customizable compositions and bonding options, it provides flexibility for both research applications and high-volume production.
For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].
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