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copper-monosulfide

VD0816 Copper Monosulfide Evaporation Materials, CuS

Catalog No.VD0816
MaterialCopper Sulfide (CuS)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

Copper monosulfide, with the chemical formula CuS, is a specialized sulfide ceramic evaporation material offered by TFM. This material is renowned for its unique properties and applications in various high-tech industries.

MSDS File
Copper Monosulfide Evaporation Materials Overview

Copper monosulfide (CuS) is a specialized sulfide ceramic evaporation material essential for high-quality deposition processes. Known for its superior performance, CuS is used in creating thin films with exceptional reliability. TFM ensures the highest purity levels, up to 99.9995%, through stringent quality control measures.

Copper Monosulfide Evaporation Materials Specification

Material TypeCopper monosulfide
SymbolCuS
Appearance/ColorBlack solid
Melting PointAbove 500 °C (932 °F; 773 K) (decomposes)
Density4.76 g/cm3
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

Applications

Copper monosulfide evaporation materials are utilized in various deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are ideal for optical applications such as wear protection, decorative coatings, and displays.

Packaging

Copper monosulfide evaporation materials are carefully tagged and labeled to ensure efficient identification and quality control. The packaging is designed to prevent damage during storage and transportation.

Contact Us

TFM is a leading supplier of high-purity copper monosulfide evaporation materials, offering them in various forms such as tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. We also provide related products including evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current prices and additional information, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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