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ST0909 Copper(I) Oxide Sputtering Targets, Cu2O

Chemical FormulaCu2O
Catalog No.ST0909
CAS Number1317-39-1
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Copper(I) Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Copper(I) Oxide (Cu₂O) Sputtering Target

Introduction

Copper(I) Oxide (Cu₂O) Sputtering Targets are advanced ceramic materials widely used in thin film deposition for semiconductors, optoelectronics, and energy devices. With its direct bandgap (~2.0 eV) and p-type semiconducting properties, Cu₂O is a highly attractive material for transparent conductive films, photovoltaic absorbers, and oxide electronics. Its ability to form stable and uniform thin films makes it a preferred choice for both research and industrial applications.

Detailed Description

Copper(I) Oxide sputtering targets are manufactured using high-purity copper oxide powders (≥99.9%) through hot pressing or sintering, resulting in dense, uniform targets with excellent mechanical stability.

Key features include:

  • High Purity – ensures reliable thin film quality with minimal contamination.

  • Direct Bandgap (2.0 eV) – ideal for optoelectronic and photovoltaic applications.

  • Stable Ceramic Microstructure – supports consistent sputtering rates and uniform thin film growth.

  • Custom Configurations – available in circular, rectangular, and planar target forms.

  • Bonding Options – indium or elastomer bonding to copper backing plates available for high-power sputtering.

Cu₂O thin films deposited from these targets can serve as active semiconductor layers, transparent conducting oxides, or catalytic surfaces depending on processing conditions.

Applications

Copper(I) Oxide sputtering targets are commonly used in:

  • Photovoltaics – absorber layers for solar cells and tandem devices.

  • Transparent Conductive Films – p-type TCO films for displays and optoelectronics.

  • Gas Sensors – thin film gas-sensing elements.

  • Catalysis – thin films for photocatalytic and electrocatalytic reactions.

  • Research in Oxide Electronics – studies on novel p-type oxide semiconductors.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures high-quality thin films
CompositionCu₂O (Copper(I) Oxide)P-type semiconductor
Diameter25 – 200 mm (customizable)Compatible with sputtering systems
Thickness3 – 10 mmInfluences deposition rate
BondingIndium / Elastomer / Copper backingImproves heat transfer

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Copper(I) Oxide (Cu₂O)P-type semiconductor, bandgap ~2 eVPhotovoltaics, TCO films
Copper(II) Oxide (CuO)Narrower bandgap (~1.2 eV)Gas sensors, catalysts
Indium Tin Oxide (ITO)High transparency, conductivityDisplays, touch panels

FAQ

QuestionAnswer
What purity levels are available?Standard purities are 99.9% (3N) and 99.99% (4N).
Can the targets be bonded to backing plates?Yes, indium or elastomer bonding to copper plates is available.
Which industries benefit most from Cu₂O films?Photovoltaics, displays, gas sensors, and R&D in oxide electronics.
How are the targets packaged?Each target is vacuum-sealed, cushioned with foam, and shipped in export-safe cartons or wooden crates.
Are custom shapes available?Yes, circular, rectangular, and planar forms can be supplied.

Packaging

Copper(I) Oxide sputtering targets are individually vacuum-packed with moisture-proof protection. Each package is labeled for traceability and secured in foam-lined export cartons or wooden crates to ensure safe delivery.

Conclusion

Copper(I) Oxide (Cu₂O) Sputtering Targets are a reliable choice for producing p-type semiconducting films in solar cells, transparent electronics, and oxide-based devices. With high purity, stable ceramic structure, and customizable configurations, they provide consistent performance for both R&D and industrial thin film deposition.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

Related Products: Copper Sputtering Target, Copper (II) Selenide Sputtering Target, Copper Indium Sputtering Target

 

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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