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ST0909 Copper(I) Oxide Sputtering Targets, Cu2O

Chemical FormulaCu2O
Catalog No.ST0909
CAS Number1317-39-1
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Copper(I) Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Copper(I) Oxide Sputtering Targets Description

Copper(I) Oxide Sputtering Target is a specialized material used in sputter deposition, a technique employed to deposit thin films onto substrates with precision and control. This method is commonly used in the production of electronic devices, solar cells, and various other applications.

During the sputtering process, the Copper(I) Oxide Sputtering Target is bombarded with high-energy ions. This bombardment causes atoms or molecules to be ejected from the target material, which then deposit onto a substrate, forming a thin film. The resulting Copper(I) Oxide thin film can exhibit distinctive electrical, optical, or catalytic properties, tailored to meet the specific needs of the application.

Related Products: Copper Sputtering Target, Copper (II) Selenide Sputtering Target, Copper Indium Sputtering Target

Copper(I) Oxide Sputtering Targets Specifications

Compound FormulaCu2O
Molecular Weight143.09
Appearancebrownish-red solid
Melting Point (℃)1235
Boiling Point (℃)1800
Density (g/cm3)6.0
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Copper(I) Oxide Sputtering Targets Application

Copper(I) Oxide Sputtering Target is well-suited for applications including electrochromic devices, batteries, and catalysts. This sputtering target enables precise control over the composition and thickness of the deposited thin film, making it an invaluable tool in materials science and device manufacturing.

Copper(I) Oxide Sputtering Targets Packaging

Our Copper(I) Oxide Sputtering Targets are meticulously handled throughout storage and transportation to ensure that they maintain their quality and integrity in their original condition.

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TFM offers Copper(I) Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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