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VD0544A Copper(I) Telluride Pellet Evaporation Material (Cu2Te)

MSDS File
Material TypeCopper(I) Telluride
SymbolCu2Te
Color/Appearance
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio–
E-Beam–
Thermal Evaporation TechniquesBoat:  –
Crucible:  –
E-Beam Crucible Liner Material–
Temp. (°C) for Given Vap. Press. (Torr)–
Comments–

Copper(I) Telluride Pellet Evaporation Material

TFM offers high-purity Copper(I) Telluride (Cu₂Te) Pellet Evaporation Material, widely used in thin-film deposition, optoelectronics, and semiconductor applications. Known for its excellent stability and high electrical conductivity, Cu₂Te is an essential material for infrared detectors, thermoelectric devices, and advanced electronic components.

Key Features and Advantages

  • High Purity (99.99% – 99.999%): Ensures superior material quality for precise thin-film deposition.

  • Stable Crystal Structure: Can be stored at room temperature without degradation, ensuring long-term usability.

  • Excellent Electrical & Optical Properties: Ideal for infrared detection, energy conversion, and semiconductor applications.

  • Optimized for Thin-Film Deposition: Suitable for thermal evaporation and electron beam (E-beam) evaporation.

  • Available in Multiple Forms: Offered in pellets, pieces, and powder to meet various research and industrial needs.

Applications

  • Infrared Detectors & Sensors – Utilized in infrared imaging, night vision, and spectroscopic applications.

  • Thermoelectric Devices – Plays a key role in energy harvesting and temperature control technologies.

  • Thin-Film Semiconductor Coatings – Used in optoelectronic components, photovoltaics, and specialty coatings.

  • Advanced Research & Development – Supports cutting-edge studies in material science and nanotechnology.

Industry Impact

TFM’s Copper(I) Telluride Pellet Evaporation Material is a critical component for semiconductor research, optoelectronic advancements, and infrared applications. With high purity, exceptional stability, and tailored deposition properties, Cu₂Te from TFM ensures consistent and reliable performance for advanced material development and next-generation electronics.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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