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ST0929 Cryolite Sputtering Target, Na₃AlF₆

Chemical FormulaNa3·AlF6
Catalog No.ST0929
CAS Number15096-52-3
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Cryolite sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Cryolite Sputtering Target (Na₃AlF₆) is a fluoride-based ceramic material primarily used for depositing fluoride thin films with low refractive index and high optical transparency. As an aluminum sodium fluoride compound, cryolite plays an important role in optical coating systems, especially where controlled light transmission, anti-reflective performance, and electrical insulation are required.

In thin film deposition processes, cryolite targets are selected for their chemical stability, wide band gap, and compatibility with multilayer optical stacks. They are particularly suitable for research laboratories and industrial production lines involved in precision optical components and specialized dielectric coatings.

Detailed Description

Cryolite (Na₃AlF₆) is a crystalline fluoride compound characterized by low optical absorption in the visible and infrared regions. When fabricated into sputtering targets, it is typically produced using high-purity raw materials followed by controlled sintering to achieve dense, homogeneous ceramic bodies.

Because fluoride ceramics are inherently brittle, manufacturing focuses on:

  • High density and low porosity to reduce particle generation

  • Uniform grain structure to maintain stable sputtering rate

  • Controlled impurity levels to preserve optical transparency

  • Optional bonding to copper backing plates for enhanced thermal management

Cryolite targets are generally used in RF magnetron sputtering systems due to their insulating nature. Proper power ramp-up and stable vacuum conditions are important to prevent thermal shock or cracking.

The deposited films typically exhibit:

  • Low refractive index (~1.34–1.36 at 550 nm)

  • High transparency across UV–visible–IR ranges

  • Good chemical resistance in dry environments

  • Excellent dielectric properties

These characteristics make cryolite an effective low-index material in multilayer interference coatings.

Applications

Cryolite Sputtering Targets are widely applied in:

  • Anti-reflective (AR) coatings

  • Optical interference filters

  • Laser mirror coatings

  • Infrared transmission coatings

  • Dielectric insulation layers

  • Multilayer optical stacks paired with high-index materials (e.g., TiO₂, Ta₂O₅)

  • Research and development of fluoride-based thin films

In precision optics, cryolite films are often alternated with high-refractive-index layers to form high-performance interference structures.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaNa₃AlF₆Defines fluoride optical characteristics
Purity99.9% – 99.99%Ensures optical clarity and film consistency
Diameter25 – 200 mm (custom)Matches sputtering cathode holders
Thickness3 – 6 mmInfluences lifetime and deposition rate
Density≥ 95% theoreticalReduces particle contamination
BondingCopper backing plate (optional)Improves heat dissipation

Custom shapes and segmented targets can be provided for large-area coating systems.

Comparison with Related Fluoride Materials

MaterialKey AdvantageTypical Application
Cryolite (Na₃AlF₆)Low refractive index, stable fluoride filmAR coatings & optical stacks
Magnesium Fluoride (MgF₂)Excellent UV transparencyUV optics & AR coatings
Aluminum Fluoride (AlF₃)Good chemical stabilityProtective fluoride coatings
Calcium Fluoride (CaF₂)High IR transmissionInfrared optical systems

Compared to MgF₂, cryolite offers a slightly different refractive index profile and can be advantageous in multilayer optical design optimization.

FAQ

QuestionAnswer
Is Cryolite an insulating material?Yes, it is a dielectric ceramic and typically requires RF sputtering.
Can the target be bonded to a backing plate?Yes, copper backing improves thermal stability during sputtering.
Is it suitable for DC sputtering?Generally no, unless specialized conductive configurations are used.
What film properties can be expected?Low refractive index, high transparency, and good dielectric behavior.
How should it be stored?Store in a dry environment to prevent moisture interaction.

Packaging

Our Cryolite Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Cryolite Sputtering Targets provide a reliable low-index fluoride solution for advanced optical coatings and dielectric thin film applications. With controlled purity, stable sputtering behavior, and customizable dimensions, they are well suited for both research and industrial optical production environments.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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