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VD0779 Dysprosium(III) Fluoride Evaporation Materials, DyF3

Catalog No.VD0779
MaterialDysprosium Fluoride (DyF3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM excels as a leading manufacturer and supplier of high-purity Dysprosium(III) Fluoride evaporation materials. Our product range includes various evaporation materials, all available in powder and granule forms. Customized options are also available to meet specific requirements upon request.

MSDS File

Dysprosium(III) Fluoride Evaporation Materials Overview

Dysprosium(III) Fluoride (DyF₃) is a high-purity fluoride ceramic evaporation material essential for various deposition processes. TFM (Thin-Film Mat Engineering) provides Dysprosium(III) Fluoride with a remarkable purity level of up to 99.9995%. This high purity is crucial for achieving superior quality in deposited films. At TFM, we employ rigorous quality assurance practices to ensure the reliability and excellence of our products.

Applications of Dysprosium(III) Fluoride Evaporation Materials

Dysprosium(III) Fluoride is utilized in several deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Its applications are diverse, spanning optics, wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our Dysprosium(III) Fluoride evaporation materials are meticulously tagged and labeled to facilitate easy identification and quality control. We prioritize careful handling to prevent any damage during storage or transport, ensuring that the materials reach you in optimal condition.

Contact Us

TFM is a premier provider of high-purity Dysprosium(III) Fluoride evaporation materials. We offer various forms, including tablets, granules, rods, and wires, with custom shapes and quantities available upon request. In addition to our evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information, please reach out to us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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