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Dysprosium-Iron Sputtering Target

ST0959 Dysprosium-Iron Sputtering Target, DyFe

Chemical FormulaDy-Fe
Catalog No.ST0959
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Dysprosium-Iron sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

MSDS File

Dysprosium-Iron Sputtering Target Description

Dysprosium-Iron Sputtering Targets are highly specialized materials employed in the sputtering process for thin film deposition. This process involves directing high-energy ions at the target material, which causes atoms to be ejected and subsequently deposited onto a substrate, forming a thin film with desired properties.

To ensure optimal film performance and stability, precision alloys of dysprosium and iron are utilized, achieving exact chemical compositions during sputtering. The Dysprosium-Iron Sputtering Targets offered by TFM are meticulously crafted to attain exceptional purity, effectively eliminating impurities and enhancing film uniformity. These targets also feature excellent electrical conductivity, which supports consistent deposition across the target surface, leading to higher deposition efficiency and superior film quality. Additionally, their stable crystal structure contributes to reliable long-term performance, reducing the need for frequent maintenance and prolonging the lifespan of equipment.

Related Product: Dysprosium Sputtering Target, Dysprosium Oxide Sputtering Target

Dysprosium-Iron Sputtering Target Specifications

Compound FormulaDyFe
Molecular Weight–
AppearanceBlack Target
Melting Point–
Density–
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Dysprosium-Iron Sputtering Target Handling Notes

Indium bonding is recommended for Dysprosium-Iron Sputtering Targets due to specific characteristics that make them challenging to sputter effectively, such as brittleness and low thermal conductivity. These targets are prone to thermal shock, which can compromise their performance during the sputtering process. Indium bonding helps mitigate these issues by providing a more stable and conductive interface, enhancing the overall durability and efficiency of the sputtering process.

Dysprosium-Iron Sputtering Target Application

Magnetic Storage Technology: Dysprosium-Iron Sputtering Targets are essential in the production of magnetic disks and sensors, known for enhancing storage density and sensor performance due to their superior magnetic properties.

Magnetic Sensor Manufacturing: These targets are used in high-performance magnetic sensors, such as those in navigation systems and magnetometers, ensuring heightened sensitivity and accuracy.

Optical Thin-Film Technology: In the creation of lasers and optical devices, Dysprosium-Iron Sputtering Targets are used to deposit magnetic thin films, allowing precise control over the optical characteristics.

Electronic Component Applications: These targets are also employed in the fabrication of advanced electronic components, including magnetoresistors and magneto-electric inductors, providing high-quality materials for the electronics industry.

Dysprosium-Iron Sputtering Target Packaging

Our Dysprosium-Iron Sputtering Target is meticulously managed during storage and transportation to ensure that it retains its quality and integrity throughout.

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TFM offers Dysprosium-Iron Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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