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Dysprosium Oxide Sputtering Target

ST0145 Dysprosium Oxide Sputtering Target, Dy2O3

Chemical Formula: Dy2O3
Catalog Number: ST0145
CAS Number: 1308-87-8
Purity: 99.9%, 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Dysprosium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Dysprosium Oxide Sputtering Target Description

The Dysprosium Oxide Sputtering Target from TFM is an oxide sputtering material with the chemical formula Dy2O3.

DysprosiumDysprosium is a chemical element originated from the Greek ‘dysprositos’, meaning hard to get. It was first mentioned in 1886 and observed by P.E.L. de Boisbaudran. “Dy” is the canonical chemical symbol of dysprosium. Its atomic number in the periodic table of elements is 66 with location at Period 6 and Group 3, belonging to the f-block. The relative atomic mass of dysprosium is 162.500(1) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Dysprosium Sputtering Target

Dysprosium Oxide (Dy2O3) is a sesquioxide compound of the rare earth metal dysprosium. It appears as a pastel yellowish-greenish, slightly hygroscopic powder. Dysprosium Oxide has specialized applications in ceramics, glass, phosphors, lasers, and dysprosium metal halide lamps. It reacts with acids to produce the corresponding dysprosium(III) salts, as shown in the reaction:

Dy2O3 + 6 HCl → 2 DyCl3 + 3 H2O

This reaction highlights its chemical reactivity and utility in various industrial processes.

Dysprosium Oxide Sputtering Target Specification

Material TypeDysprosium Oxide
SymbolDy2O3
Color/AppearanceWhite
Melting Point2,408° C (4,366° F)
Type of BondIndium
Density7.81 g/cm3

Dysprosium Oxide Sputtering Target Target Bonding

Specialized bonding services for Dysprosium Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

 

Dysprosium Oxide Sputtering Target Application

The Dysprosium Oxide Sputtering Target is utilized in a variety of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also important for functional coatings, the optical information storage industry, glass coatings for automotive and architectural applications, and optical communication systems, among other fields.

Packaging

Our Dysprosium Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

Get Contact

TFM offers Dysprosium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

 

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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