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VD0780 Erbium(III) Fluoride Evaporation Materials, ErF3

Catalog No.VD0780
MaterialErbium Fluoride (ErF3)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier provider of high-purity Erbium(III) Fluoride for evaporation applications, alongside an extensive range of other evaporation materials. Our offerings include both powder and granule forms, with the option for customized formats to meet specific requirements.

MSDS File

Erbium(III) Fluoride Evaporation Materials Overview

TFM offers high-purity Erbium(III) Fluoride evaporation materials, characterized by the chemical formula ErF3. These fluoride ceramic materials are essential in deposition processes, ensuring the production of high-quality films. Our Erbium(III) Fluoride materials are produced with a purity of up to 99.9995%, backed by rigorous quality assurance to ensure reliability.

Related Products: Erbium Evaporation Materials, Fluoride Ceramic Evaporation Materials

Erbium(III) Fluoride Evaporation Materials Specification

Material TypeErbium(III) Fluoride
SymbolErF3
Appearance/ColorPinkish Solid
Melting Point1,146 °C (2,095 °F; 1,419 K)
Density7.820g/cm
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

Applications

Our Erbium(III) Fluoride evaporation materials are utilized in various deposition processes including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are primarily used in optics for applications such as wear protection, decorative coatings, and display technologies.

Packaging

To ensure optimal quality and efficient handling, our Erbium(III) Fluoride materials are carefully packaged and clearly labeled. We take meticulous care to prevent any damage during storage and transportation.

Contact Us

TFM is a top-tier manufacturer and supplier of high-purity Erbium(III) Fluoride evaporation materials. We offer various shapes including tablets, granules, rods, and wires, with custom options available upon request. In addition to evaporation materials, we also provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about additional materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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