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ST0241 Erbium Fluoride Sputtering Target, ErF3

Chemical Formula: ErF3
Catalog Number: ST0241
CAS Number: 13760-83-3
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Erbium Fluoride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Erbium Fluoride Sputtering Target Description

Erbium fluoride sputtering target is a specialized fluoride ceramic material consisting of the elements erbium (Er) and fluorine (F). This target is used in various thin-film deposition processes, including the production of optical coatings, electronics, and other advanced material applications. The inclusion of erbium, a rare earth element, provides unique optical and electronic properties that are valuable in these industries.

ErbiumErbium is a chemical element that originated from Ytterby, Sweden, and was first mentioned in 1842 by G. Mosander. The canonical chemical symbol for erbium is “Er.” It is located in the periodic table with an atomic number of 68, situated in Period 6 and Group 3, belonging to the f-block. The relative atomic mass of erbium is 167.259(3) Dalton, with the number in brackets indicating the measurement uncertainty.

Related Product: Erbium Sputtering Target

Fluorine

Fluorine, also known as “fluorin,” is a chemical element that derives its name from the Latin word ‘fluere,’ meaning “to flow.” It was first mentioned in 1810 by A.-M. Ampère and later isolated by H. Moissan. The chemical symbol for fluorine is “F.” It has an atomic number of 9 and is located in Period 2 and Group 17 of the periodic table, part of the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in brackets indicating the uncertainty of this measurement.

Erbium Fluoride Sputtering Target Application

The erbium fluoride sputtering target is utilized in various applications, including thin film deposition for decoration, semiconductor fabrication, display technology, LED production, and photovoltaic devices. It is also used in functional coatings, optical information storage industries, and glass coatings, such as those for automotive and architectural glass. Additionally, it finds application in optical communication technologies, leveraging its unique properties to enhance performance in these fields.

Erbium Fluoride Sputtering Target Packing

Our erbium fluoride sputter targets are meticulously tagged and labeled externally to ensure clear identification and maintain high-quality control standards. We take great care in handling and packaging to prevent any damage during storage or transportation, ensuring that the products reach their destination in optimal condition.

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TFM offers Erbium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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