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Europium Nitride Sputtering Target

ST0960 Europium Nitride Sputtering Target, EuN

Chemical FormulaEuN
Catalog No.ST0960
CAS Number12020-58-5
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Europium Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Europium Nitride Sputtering Target Description

Europium Nitride Sputtering Targets from TFM are crafted with exceptional precision and high purity, ensuring the production of pure and uniform thin films. The presence of europium endows these targets with notable magnetic properties, making them ideal for creating magnetic materials used in storage devices and magnetic sensors. The chemical stability of Europium Nitride ensures dependable performance in long-term applications and experiments. With high conductivity, these sputtering targets facilitate uniform deposition, enhancing both film quality and performance. Europium Nitride Sputtering Targets are extensively utilized in the fabrication of optical and magnetic films, as well as electronic components, providing essential material support for advanced technology applications.

Related Product: Europium Sputtering Target, Europium Oxide Sputtering Target

Europium Nitride Sputtering Target Specifications

Compound FormulaEuN
Molecular Weight165.97
AppearanceBlack Target
Melting Point–
Density–
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Europium Nitride Sputtering Target Handling Notes

Indium bonding is advised for Europium Nitride Sputtering Targets due to their inherent characteristics that are less suited for sputtering, such as brittleness and low thermal conductivity. This material’s low thermal conductivity and susceptibility to thermal shock highlight the need for indium bonding to ensure effective performance and stability during the sputtering process.

Europium Nitride Sputtering Target Application

Optical Thin Film Technology: Europium Nitride Sputtering Targets are essential for creating high-performance optical thin films, including reflector sheets and coatings for lasers and other optical devices.

Magnetic Thin Film Applications: The magnetic properties of Europium Nitride make it crucial for magnetic storage solutions, magnetic sensors, and other magnetic components, enhancing their functionality and efficiency.

Electronic Component Manufacturing: These targets are used to produce thin films for advanced electronic components, such as magnetoresistors and magneto-electric sensors, improving their performance and reliability.

Magneto-Optical Storage Technology: Europium Nitride Sputtering Targets are utilized in magneto-optical storage systems to develop high-density, high-performance magnetic storage media.

Magnetic Navigation Systems: In magnetic navigation systems, these targets are applied to manufacture sensitive and accurate magnetic sensors, ensuring precise navigation capabilities.

Europium Nitride Sputtering Target Packaging

Our Europium Nitride Sputtering Target is meticulously handled throughout storage and transportation to maintain the product’s quality and integrity in its original state.

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TFM offers Europium Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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