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europium-evaporation

VD0686 Europium(III) Oxide Evaporation Materials, Eu2O3

Catalog No.VD0686
MaterialEuropium Oxide (Eu2O3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier producer and provider of high-purity europium(III) oxide evaporation materials, alongside an extensive range of other evaporation materials. We supply these materials in both powder and granule forms, with the flexibility to deliver customized solutions tailored to your specific needs.

MSDS File

Europium(III) Oxide Evaporation Materials Overview

TFM specializes in the production and supply of high-purity europium(III) oxide evaporation materials, identified by the chemical formula Eu2O3. These materials are essential in deposition processes, contributing to the formation of high-quality films. With purity levels reaching up to 99.9995%, TFM ensures product consistency and reliability through rigorous quality assurance protocols.

Related Products: Europium Evaporation Materials

Europium(III) Oxide Evaporation Materials Specifications

Material Type Europium(III) Oxide
Form Evaporation Materials
Symbol Eu2O3
Color/Appearance White to light-pink Solid
Melting Point  2,350 °C
Density 7.42 g/cm3
Purity 99.5% ~ 99.99%
Shape Powder/ Granule/ Custom-made

Applications of Europium(III) Oxide Evaporation Materials

Europium(III) oxide evaporation materials are widely utilized in various advanced applications:

  • Deposition Processes: Crucial for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Uses: Employed in coatings for wear protection, decorative finishes, and display technologies.

Packaging Information

TFM ensures that europium(III) oxide evaporation materials are meticulously labeled and tagged for easy identification and to maintain stringent quality control. All products are packaged with care to prevent damage during storage and transportation.

Contact Us

TFM is a leading provider of high-purity europium(III) oxide evaporation materials, available in various forms such as tablets, granules, rods, and wires. We also offer custom shapes and quantities to meet your specific needs. In addition to evaporation materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. Please contact us for current pricing or to inquire about materials not listed.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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