ST0424 Fluorine Doped Tin Oxide FTO Sputtering Target
Chemical Formula: SnO2/F
Catalog Number: ST0424
Purity: 99.9%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
fluorine-doped tin oxide (FTO) sputtering target come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.
Fluorine Doped Tin Oxide FTO Sputtering Target Description
Tin, also known as stannum, is a chemical element with the symbol “Sn” and atomic number 50. The name “tin” originates from the Anglo-Saxon word “tin,” while the Latin name “stannum” means hard. Tin has been used since around 3500 BC. It is located in Period 5 and Group 14 of the periodic table, belonging to the p-block elements. Its relative atomic mass is approximately 118.710 Daltons, with the number in parentheses indicating the uncertainty.
Tin oxide (SnO2) is a wide band-gap semiconductor that exhibits n-type character and high optical transparency due to its oxygen vacancies. When doped with fluorine, the resulting material, known as fluorine-doped tin oxide (FTO), exhibits excellent visible transparency. FTO is also known for its mechanical, chemical, and electrochemical stability, making it a versatile material for various applications.
Related Product: Tin Sputtering Target
Fluorine Doped Tin Oxide FTO Sputtering Target Specification
| Material Type | Fluorine Doped Tin Oxide (FTO) |
| Symbol | SnO2/F |
| Color/Appearance | Sage green target |
| Melting Point | >1630° C |
Fluorine Doped Tin Oxide FTO Sputtering Target Application
The fluorine-doped tin oxide (FTO) sputtering target is utilized for thin film deposition in various applications including decoration, semiconductors, displays, LEDs, and photovoltaic devices. It is also used for functional coatings in the optical information storage industry, glass coating applications such as automotive and architectural glass, and in optical communication devices.
Fluorine Doped Tin Oxide FTO Sputtering Target Packaging
Our fluorine-doped tin oxide (FTO) sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to prevent any damage during storage and transportation, preserving the quality of our products in their original condition.
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FAQ
What is a sputtering target?
It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.
What materials are used to make sputtering targets?
Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.
How are sputtering targets manufactured?
They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.
How does sputter deposition work with these targets?
In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.
What factors affect the life and performance of a sputtering target?
Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.
How do I know when a sputtering target needs to be replaced?
Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.
Why do some sputtering targets need to be bonded to backing plates?
Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.
What is the difference between DC and RF sputtering for targets?
DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.
How does reactive sputtering differ from standard sputtering?
In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.
Can I use customer-supplied powders to make sputtering targets?
Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.
What storage and handling procedures are recommended for sputtering targets?
Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.
What key parameters affect sputtering deposition rates?
Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).
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