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ST0437 Gadolinium Cerium Oxide Sputtering Target, Gd0.2Ce0.8O2

Chemical Formula: Gd0.2Ce0.8O2
Catalog Number: ST0437
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gadolinium Cerium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Gadolinium Cerium Oxide Sputtering Target (Gd₀.₂Ce₀.₈O₂) is a high-performance ceramic target used for depositing functional oxide thin films in energy devices, electronic components, and advanced materials research. This compound, commonly referred to as Gadolinium-Doped Ceria (GDC), is well known for its excellent oxygen ion conductivity, chemical stability, and catalytic activity.

Gd-doped cerium oxide is widely studied and utilized in solid oxide fuel cells (SOFCs), oxygen sensors, catalytic coatings, and energy conversion systems. Using magnetron sputtering or other physical vapor deposition (PVD) methods, GDC sputtering targets enable the deposition of dense and uniform thin films with controlled stoichiometry and microstructure.

Detailed Description

Gadolinium Cerium Oxide sputtering targets are produced from high-purity cerium oxide (CeO₂) and gadolinium oxide (Gd₂O₃) powders using advanced ceramic fabrication techniques. These powders are carefully mixed, calcined, and sintered through processes such as hot pressing, vacuum sintering, or hot isostatic pressing (HIP) to achieve a dense and homogeneous ceramic structure.

The chemical composition Gd₀.₂Ce₀.₈O₂ represents a typical doping ratio where gadolinium partially substitutes cerium in the ceria lattice. This substitution creates oxygen vacancies within the crystal structure, significantly enhancing oxygen ion conductivity. As a result, GDC materials are widely used as electrolytes or interlayers in high-temperature electrochemical devices.

Compared with pure cerium oxide, gadolinium doping improves ionic conductivity and enhances catalytic activity while maintaining good thermal stability. These characteristics make GDC thin films particularly suitable for applications involving oxygen transport, catalytic reactions, and electrochemical energy conversion.

High-density sputtering targets ensure stable sputtering rates, consistent film composition, and minimal particle generation during deposition. For high-power sputtering systems, Gd₀.₂Ce₀.₈O₂ targets can also be supplied as bonded targets with copper backing plates, typically using indium bonding to improve thermal management and mechanical stability.

Applications

Gadolinium Cerium Oxide sputtering targets are widely used in advanced energy and electronic technologies:

  • Solid oxide fuel cells (SOFCs) as electrolyte or buffer layers

  • Oxygen sensors and gas sensors for environmental monitoring

  • Catalytic coatings for energy and environmental applications

  • Electrochemical devices requiring oxygen-ion conducting materials

  • Thin film energy conversion systems

  • Research and development of advanced oxide ionic conductors

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaGd₀.₂Ce₀.₈O₂ (GDC)Determines oxygen ion conductivity
Purity≥ 99.9%Ensures stable electrochemical properties
Diameter25 – 300 mm (custom)Compatible with standard sputtering systems
Thickness3 – 6 mmInfluences sputtering stability and target lifetime
Density≥ 95% theoretical densityEnsures uniform film deposition
BondingCopper backing plate / Indium bondedImproves heat dissipation during sputtering

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Gadolinium Cerium Oxide (GDC)High oxygen ion conductivity and catalytic activitySOFC electrolytes and sensors
Cerium Oxide (CeO₂)Excellent catalytic and oxygen storage propertiesCatalysis and oxygen storage materials
Yttria-Stabilized Zirconia (YSZ)Stable ionic conductor at high temperatureSolid oxide fuel cell electrolytes

FAQ

QuestionAnswer
What sputtering methods are suitable for GDC targets?Gd₀.₂Ce₀.₈O₂ targets are typically used in RF magnetron sputtering systems designed for ceramic materials.
Can the doping ratio be customized?Yes. The gadolinium-to-cerium ratio can be adjusted depending on ionic conductivity requirements.
Are bonded sputtering targets available?Yes. Ceramic targets can be bonded to copper backing plates using indium bonding to improve heat dissipation.
What substrates can GDC thin films be deposited on?Films can be deposited on silicon wafers, ceramic substrates, stainless steel, and other oxide materials.
What industries commonly use GDC materials?Energy technology, fuel cell research, sensor development, and advanced materials science.

Packaging

Our Gadolinium Cerium Oxide Sputtering Target (Gd₀.₂Ce₀.₈O₂) products are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. Each target is packaged in vacuum-sealed bags with protective foam and export-grade cartons or wooden crates to prevent contamination and mechanical damage during storage and transportation.

Conclusion

The Gadolinium Cerium Oxide Sputtering Target (Gd₀.₂Ce₀.₈O₂) is an important material for producing oxygen-ion conducting thin films used in fuel cells, sensors, and advanced electrochemical devices. Its high ionic conductivity, chemical stability, and catalytic properties make it highly valuable in modern energy technologies.

With customizable compositions, high-density ceramic manufacturing, and stable sputtering performance, GDC sputtering targets support both industrial applications and cutting-edge research in functional oxide materials.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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