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Gadolinium-Doped Ceria (GDC) Sputtering Target

Gadolinium-Doped Ceria (GDC) Sputtering Target

Gadolinium-Doped Ceria (GDC) Sputtering Target Description

Unlock cutting-edge advancements in solid-state technology with Gadolinium-Doped Ceria (GDC) Sputtering Targets—engineered to deliver exceptional ionic conductivity, thermal stability, and performance in energy and environmental applications. This page highlights the synergistic interaction of cerium and gadolinium, driving innovation in fuel cells, sensors, and thin film research.

Ceria: A Foundation for Ionic Transport

Ceria (CeO₂) serves as a core material in oxygen-ion conduction due to its fluorite-type crystal structure and ability to readily shift oxidation states. Its intrinsic oxygen vacancy mechanism makes it a highly efficient medium for ion transport, which is pivotal in solid oxide fuel cells (SOFCs) and oxygen sensors. When doped with gadolinium, ceria’s ionic conductivity increases significantly, making GDC a cornerstone in high-temperature electrochemical systems.

Gadolinium: The Dopant That Transforms

Gadolinium (Gd) introduces critical oxygen vacancies into the ceria lattice, dramatically improving its ionic transport characteristics. This controlled doping enhances both the performance and stability of the material at intermediate temperatures, offering substantial advantages in terms of efficiency and longevity. GDC sputtering targets are ideal for applications requiring high oxygen ion conductivity without compromising chemical and thermal integrity.

Related Products: Cerium Oxide (CeO₂) Sputtering Target, Gadolinium Oxide (Gd₂O₃) Sputtering Target

Gadolinium-Doped Ceria Sputtering Target Specifications

SpecificationDetails
Material TypeGadolinium-Doped Ceria
Chemical FormulaGdₓCe₁₋ₓO₂ (commonly x = 0.1 – 0.2)
Color/AppearancePale yellow to ivory-white, ceramic solid
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″; Thick: 0.125″, 0.250″
Purity99.9% standard (High purity options up to 99.995%)
PackagingVacuum-sealed with individual labeling and cushioning

GDC Sputtering Target Applications

Advanced Energy Conversion:

GDC targets are critical in the fabrication of electrolyte layers for SOFCs, enabling lower operating temperatures and improved fuel cell efficiency.

Gas Sensing Technologies:

Used in oxygen and NOx sensors, GDC films offer high sensitivity, fast response times, and long-term operational stability.

Thin Film Electrolytes:

Ideal for creating thin, dense electrolyte layers in next-generation micro-fuel cells and solid-state ionics.

Environmental & Catalytic Coatings:

Promotes oxygen storage and redox reactions, making it effective in catalytic converters and air purification technologies.

Materials Science Research:

GDC supports breakthroughs in ionic transport mechanisms, nanostructured oxide systems, and defect chemistry.

GDC Sputtering Target Advantages

Enhanced Ionic Conductivity:

Doping ceria with gadolinium significantly increases oxygen ion mobility, enabling efficient ionic transfer at reduced temperatures.

Thermal and Chemical Stability:

GDC films retain structural integrity and resist reduction even under demanding SOFC or catalytic conditions.

Versatile Thin Film Integration:

Compatible with a wide range of substrates and deposition techniques, making it ideal for R&D and commercial manufacturing.

Eco-Efficient Innovation:

Supports clean energy goals by enabling more efficient fuel cell operation and lower emissions in combustion processes.

Power Up with GDC Sputtering Targets

Whether you’re working on the next-generation SOFC system, developing high-performance sensors, or exploring electrochemical thin film technologies, Gadolinium-Doped Ceria Sputtering Targets offer unmatched reliability and performance. Our team is ready to assist with custom sizes, doping ratios, and bonding services tailored to your unique application. Contact us today and take your innovation to the next level with premium GDC materials.

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Ce₀.₉Gd₀.₁ Target 99.99% ø50.8×6mm Indium Bonded Cu B/Plate 1.5mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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