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VD0781 Gadolinium(III) Fluoride Evaporation Materials, GdF3

Catalog No.VD0781
MaterialGadolinium Fluoride (GdF3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of manufacturing and supplying premium-grade Gadolinium(III) Fluoride evaporation materials. We provide these materials in both powder and granule formats, with the option for custom formulations tailored to specific requirements. Our commitment to high purity and quality ensures optimal performance in various applications.

MSDS File

Gadolinium(III) Fluoride Evaporation Materials Overview

Gadolinium(III) Fluoride (GdF3) is a specialized fluoride ceramic material utilized in evaporation processes. TFM’s Gadolinium(III) Fluoride evaporation materials are renowned for their high purity, achieving up to 99.9995% purity. This ensures exceptional quality in the deposited films across various applications. Our rigorous quality assurance processes underscore our commitment to product reliability.

Applications of Gadolinium(III) Fluoride Evaporation Materials

Gadolinium(III) Fluoride evaporation materials are integral to several deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are primarily employed in optical applications such as wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

Our Gadolinium(III) Fluoride materials are meticulously packaged with clear labeling to facilitate easy identification and quality control. We ensure that the materials are safeguarded against any potential damage during storage and transportation.

Contact Us

TFM offers a range of Gadolinium(III) Fluoride evaporation materials in various forms, including tablets, granules, rods, and wires. We also provide custom formulations and quantities based on your specific needs. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about other materials, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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