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Zinc Fluoride Sputtering Target

ST0242 Gadolinium Fluoride Sputtering Target, GdF3

Chemical Formula: GdF3
Catalog Number: ST0242
CAS Number: 13765-26-9
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gadolinium Fluoride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Gadolinium Fluoride Sputtering Target Description

Gadolinium fluoride sputtering target is a ceramic material consisting of gadolinium and fluorine, commonly used in thin film deposition. This material finds applications in various high-tech industries, including semiconductors, displays, LEDs, photovoltaic devices, and optical coatings, due to its specific properties that are beneficial for these applications.

GadoliniumGadolinium is a chemical element named after Johan Gadolin, a chemist, physicist, and mineralogist. It was first noted in 1880, with its discovery credited to J. C. G. de Marignac. The element was later isolated and announced by F. L. de Boisbaudran. Represented by the symbol “Gd,” gadolinium has an atomic number of 64, placing it in Period 6 and Group 3 of the f-block on the periodic table. Its relative atomic mass is 157.25(3) Dalton, with the figure in parentheses indicating the measurement’s uncertainty.

Related Product: Gadolinium Sputtering Target

Fluorine

Fluorine, also known as “fluorin,” is a chemical element that derives its name from the Latin word ‘fluere,’ meaning “to flow.” This element was first noted in 1810 by A.-M. Ampère, with its isolation and formal announcement later accomplished by H. Moissan. The chemical symbol for fluorine is “F,” and it holds the atomic number 9 in the periodic table. It is situated in Period 2, Group 17, within the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in parentheses indicating the uncertainty in the measurement.

Gadolinium Fluoride Sputtering Target Application

The gadolinium fluoride sputtering target is utilized in various applications including thin film deposition, decoration, semiconductor manufacturing, displays, LED and photovoltaic devices. Additionally, it serves in functional coatings and is used in the optical information storage industry, as well as in glass coating for automotive and architectural purposes. The material is also applicable in optical communication systems.

Gadolinium Fluoride Sputtering Target Packing

Our gadolinium fluoride sputter targets are carefully tagged and labeled externally to ensure efficient identification and strict quality control. We take great care in packaging and handling these targets to prevent any potential damage during storage or transportation, ensuring they reach you in optimal condition.

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TFM offers Gadolinium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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