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Gadolinium Titanate Sputtering Target, GdTiO₃

Chemical Formula: GdTiO₃
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gadolinium Titanate Sputtering Target is available in multiple purities, sizes, and configurations to meet diverse thin film deposition requirements. Thin Film Materials (TFM) manufactures and supplies high-quality GdTiO₃ sputtering targets with excellent density, homogeneity, and surface finish, ensuring stable performance in various PVD coating and electronic applications.

COA_GdTiO₃Pdf

Gadolinium Titanate (GdTiO₃) Sputtering Target

Introduction

Gadolinium Titanate (GdTiO₃) sputtering target is a high-purity ceramic oxide material with a perovskite crystal structure. It is widely used in thin-film research and functional coating applications that demand precise magnetic, dielectric, and electronic properties. Known for its stable crystal lattice and mixed ionic–electronic conduction, GdTiO₃ is an important material in the study of multiferroics, oxide electronics, and next-generation memory devices.

Detailed Description

The GdTiO₃ sputtering target is typically synthesized via a solid-state reaction or chemical co-precipitation method, followed by high-temperature sintering to achieve excellent homogeneity and density. This ensures consistent sputtering performance and uniform thin-film growth.

The perovskite-type GdTiO₃ combines gadolinium’s magnetic moment with titanium’s semiconducting characteristics, producing tunable ferromagnetic and electronic behaviors under controlled oxygen partial pressure. Its fine-grained microstructure supports high deposition stability and minimizes particle formation during sputtering.

Available in both planar and rotary target configurations, GdTiO₃ targets can be bonded to copper, titanium, or indium backing plates to improve heat dissipation and mechanical strength under prolonged sputtering conditions.

Applications

Gadolinium Titanate thin films are applied across advanced research and device development fields, such as:

  • Spintronic and magnetic memory devices (ferromagnetic semiconductors)

  • Multiferroic and oxide heterostructures

  • Dielectric and ferroelectric thin films

  • Catalytic and electronic coatings for solid-state devices

  • Perovskite oxide interfaces in 2D electron gas (2DEG) studies

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaGdTiO₃Perovskite oxide structure
Purity99.9% – 99.99%Higher purity ensures stable film stoichiometry
Density≥ 6.2 g/cm³High density improves film uniformity
Diameter25 – 200 mm (custom)Fits standard sputtering systems
Thickness3 – 6 mmDetermines sputtering rate and target life
BondingIndium / Elastomer / CopperEnhances heat transfer
FormDisc, rectangular, or customFlexible for R&D or production use

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Gadolinium Titanate (GdTiO₃)Ferromagnetic perovskite with tunable electronic structureSpintronics, oxide electronics
Lanthanum Titanate (LaTiO₃)High dielectric constantCapacitor thin films
Strontium Titanate (SrTiO₃)Excellent lattice match with many oxidesSubstrate and interface material

FAQ

QuestionAnswer
Can the Gd/Ti ratio be customized?Yes. Custom stoichiometries or doped variants can be produced for research use.
What deposition methods are compatible?Compatible with RF/DC magnetron sputtering and pulsed laser deposition (PLD).
How is the target packaged?Vacuum-sealed in anti-static foil, cushioned with foam, and packed in export-safe cartons.
Is bonding necessary?Recommended for high-power sputtering to improve thermal stability.
Can small quantities be ordered for testing?Yes, laboratory and pilot-scale quantities are available.

Packaging

Our Gadolinium Titanate Sputtering Targets are individually tagged and vacuum-sealed to prevent contamination. External labeling ensures quick identification, and every package is reinforced with protective foam to ensure the targets arrive intact and ready for use.

Conclusion

The Gadolinium Titanate (GdTiO₃) Sputtering Target delivers exceptional reliability and compositional accuracy for advanced thin-film fabrication. With its perovskite structure and magnetic–electronic coupling properties, it is ideal for research in oxide heterostructures, spintronics, and functional coatings.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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GdTiO₃ target 99.9% Ø50.8×3 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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