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VD0846A Gallium Antimony Pellet Evaporation Material (GaSb)

MSDS File
Material TypeGallium Antimony
SymbolGaSb
Melting Point (°C)710
Theoretical Density (g/cc)5.6
Z Ratio
E-BeamFair
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
CommentsFlash evaporate

Gallium Antimony Pellet Evaporation Material

TFM offers high-purity Gallium Antimony Pellet Evaporation Material, designed for thin-film deposition in semiconductor, optoelectronic, and infrared applications. Composed of gallium (Ga) and antimony (Sb), gallium antimonide (GaSb) is a narrow-bandgap semiconductor with excellent electronic and optical properties, making it ideal for infrared photodetectors, thermophotovoltaic devices, and high-speed electronic components.

Optimized for thermal evaporation and electron beam (E-beam) deposition, this material ensures uniform film thickness, high purity, and excellent adhesion, supporting advanced research and industrial applications.

Key Features and Advantages

  • Narrow Bandgap Semiconductor: Gallium antimonide features a small bandgap (~0.72 eV), making it suitable for infrared photodetection, optoelectronic devices, and high-speed transistors.

  • Superior Infrared Absorption: Ideal for mid- and long-wavelength infrared (MWIR/LWIR) applications, enhancing thermal imaging and optical sensing.

  • High Electron Mobility: Enables fast electronic switching, supporting high-frequency applications and semiconductor research.

  • High Purity & Precise Deposition: Guarantees defect-free, uniform thin-film coatings, improving device performance and reliability.

  • Customizable Composition: TFM provides tailored specifications to meet specific research and industrial requirements.

Applications

  • Infrared Detectors & Sensors: Used in thermal imaging, night vision systems, and spectroscopy for defense, medical, and industrial applications.

  • Optoelectronics & Photonics: Applied in infrared LEDs, laser diodes, and optical modulators for telecommunications and sensing technologies.

  • Thermophotovoltaic (TPV) Devices: Enhances energy conversion efficiency in infrared power generation and renewable energy systems.

  • High-Speed Electronics: Plays a key role in high-frequency transistors, integrated circuits (ICs), and next-generation semiconductor devices.

  • Thin-Film Deposition: Ensures high-quality coatings for infrared optics, semiconductor components, and photonic applications.

Industry Impact and Customization

TFM’s Gallium Antimony Pellet Evaporation Material is a crucial material in infrared detection, high-speed optoelectronics, and advanced semiconductor research. With high purity, precise deposition control, and customizable formulations, TFM ensures its materials meet the demands of cutting-edge applications in defense, aerospace, and photonic industries.

By offering exceptional semiconductor properties, infrared absorption, and high-speed electronic capabilities, Gallium Antimony Pellet Evaporation Material from TFM is essential for developing next-generation infrared sensors, efficient thermophotovoltaic systems, and advanced optoelectronic devices.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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