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Gallium Oxide-Magnesium Oxide Sputtering Target

ST0968 Gallium Oxide-Magnesium Oxide Sputtering Target, Ga2O3-MgO

Chemical FormulaGa2O3-MgO
Catalog No.ST0968
CAS Number12064-13-0
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM is a leading provider of Gallium Oxide-Magnesium Oxide Sputtering Targets, offering exceptional quality products at highly competitive prices. With a focus on innovation and precision, TFM’s targets are engineered to meet the requirements of advanced applications in nanotechnology and thin-film deposition. Our commitment to excellence ensures that each product supports the highest standards in performance and reliability.

MSDS File

Product Overview

TFM is pleased to offer our Gallium Oxide-Magnesium Oxide (Ga2O3-MgO) Sputtering Targets, engineered to excel in the most demanding thin-film deposition applications. These targets are made from premium-quality materials to ensure exceptional performance and reliability. With a unique combination of Gallium Oxide and Magnesium Oxide, they are crucial for professionals in optics, electronics, and solar energy. Our sputtering targets provide excellent electrical insulation, a high refractive index, and remarkable corrosion resistance, making them an ideal choice for advanced technological needs.

Related Product: Gallium (III) Selenide Sputtering Target, CIGS Copper Indium Gallium-Tellurium Sputtering Target

Key Benefits

Superior Electrical Insulation: Our Gallium Oxide-Magnesium Oxide Sputtering Targets are perfect for creating dielectric films in microelectronics, offering excellent electrical insulation.

High Refractive Index: Enhance the optical properties of your coatings with our targets, which are ideal for applications such as mirrors and lenses due to their high refractive index.

Exceptional Corrosion Resistance: Ensure the durability and longevity of your coated components with our sputtering targets, known for their outstanding resistance to corrosion.

Specifications

Compound FormulaGa2O3-MgO
Molecular Weight227.81
AppearanceGrey Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Applications

Optical Coatings:

  • High-Performance Optics: Essential for developing advanced optical coatings, our targets are used in high-end optical devices like lasers, binoculars, and photographic lenses. They improve light transmission, reduce glare, and enhance the durability of optical components.
  • Protective Coatings: Deposit coatings that shield sensitive optical components from scratches and environmental damage, extending the lifespan and maintaining the performance of these products.

Electronics:

  • Insulating Layers: Utilize Ga2O3-MgO to deposit high-quality insulating layers in electronic devices, offering excellent electrical insulation that enhances device performance and longevity.
  • Integrated Circuits: Develop coatings that prevent electrical interference and improve the efficiency of integrated circuits and microchips with our material’s unique properties.

Solar Energy:

  • Anti-Reflective Coatings: Tailored for solar technology, these targets create anti-reflective coatings that boost solar panel efficiency by minimizing surface reflection and increasing sunlight absorption, thereby enhancing energy output.
  • Protective Barriers: Serve as protective barriers that guard solar cells against environmental and mechanical stresses, improving their durability and performance under varying weather conditions.

Research and Development:

  • Material Science: Researchers use Ga2O3-MgO targets to explore new material properties and applications, experimenting with different doping levels to create semiconductors with customized electronic properties.
  • Thin Film Experimentation: Vital for developing and testing new thin film technologies, these targets provide a high-quality material base for innovative research and experiments.

Specialty Applications:

  • Thermal Barriers: Take advantage of their high thermal stability to create coatings that act as thermal barriers in extreme heat environments, such as aerospace engines and high-performance automotive components.
  • Photonic Devices: Utilize the unique dielectric properties of Gallium Oxide-Magnesium Oxide to fabricate layers in photonic devices, advancing light manipulation in computing and telecommunications systems.

Handling and Storage

Given its brittleness and low thermal conductivity, we recommend using indium bonding for our Gallium Oxide-Magnesium Oxide Sputtering Targets to improve sputtering performance. Additionally, because this material is susceptible to thermal shock, it requires careful handling to ensure its integrity and performance during use.

Packaging

Each Gallium Oxide-Magnesium Oxide Sputtering Target is meticulously packaged to guarantee it arrives in optimal condition. We employ vacuum-sealed packaging to safeguard these sensitive materials during storage and transit, effectively preventing any potential damage or degradation.

Frequently Asked Questions (FAQ)

Q1: What makes Gallium Oxide-Magnesium Oxide Sputtering Targets suitable for optical applications?
A1: The combination of Gallium Oxide and Magnesium Oxide offers a high refractive index and excellent transparency in the visible spectrum. These properties make the targets ideal for fabricating advanced optical coatings, enhancing the performance of mirrors, lenses, and other optical components.

Q2: Can these sputtering targets be used in semiconductor manufacturing?
A2: Absolutely. The superb electrical insulation characteristics of Ga2O3-MgO make it well-suited for semiconductor applications. It is used to deposit thin insulating films that boost the performance and reliability of semiconductor devices.

Q3: How do the targets contribute to improving solar cell efficiency?
A3: Our sputtering targets are utilized to create anti-reflective coatings on solar cells. These coatings minimize light reflection and maximize light absorption, significantly enhancing the efficiency of solar panels.

Q4: What precautions should be taken when handling these sputtering targets?
A4: Given the material’s brittleness and low thermal conductivity, it is essential to handle the targets carefully to avoid physical damage and thermal shock. We recommend using indium bonding to enhance sputtering performance and prolong the lifespan of the targets.

Q5: What are the available sizes and how do I order a custom size?
A5: Standard diameters range from 1.0″ to 6.0″, with thicknesses of 0.125″ and 0.250″. For custom sizes, please contact us with your specifications, and our team will assist you in meeting your exact requirements.

Q6: How are the sputtering targets packaged to ensure they remain intact during transportation?
A6: Each target is vacuum-sealed to prevent oxidation and contamination. We also use protective packaging materials to secure the targets and prevent movement and shock during transit, ensuring they arrive in excellent condition.

Q7: What kind of technical support does TFM offer for using these sputtering targets?
A7: TFM provides extensive technical support, including detailed product documentation and expert consultation. We assist with setup, usage, and optimization of the sputtering targets to suit your specific application needs.

Contact Us

For more detailed information, inquiries about custom sizes, or to discuss your specific application needs, please contact TFM. We specialize in producing high-purity physical vapor deposition (PVD) materials, tailored to support advancements in semiconductor, CVD, and PVD applications within the display and optical industries. Our team is ready to assist with your specialized requirements and provide expert guidance.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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