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Gallium-Palladium Sputtering Target

ST0964 Gallium-Palladium Sputtering Target, GaPd2

Chemical FormulaGaPd2
Catalog No.ST0964
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Gallium-Palladium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Gallium-Palladium Sputtering Target Description

Gallium-Palladium Sputtering Targets are distinguished by their exceptional properties, making them ideal for a broad spectrum of applications. Precision-engineered to ensure high purity and consistency, these targets provide a reliable base for thin film deposition. The unique characteristics of Gallium-Palladium compounds make them valuable in various fields, including electronics, optics, and magnetics.

In semiconductor technology, these sputtering targets are integral for fabricating high-performance electronic devices. They are also crucial in producing optical films and exploring magnetic materials. Their versatility makes Gallium-Palladium Sputtering Targets highly desirable for both advanced research and practical applications in cutting-edge technology.

Whether used in scientific investigations or industrial processes, Gallium-Palladium Sputtering Targets contribute significantly to advancements in materials science and technological innovation.

Related Product: Gallium (III) Selenide Sputtering Target, CIGS Copper Indium Gallium-Palladium Sputtering Target

Gallium-Palladium Sputtering Target Specifications

Compound FormulaGaPd2
Molecular Weight282.6
AppearanceSilver Metallic Target
Melting Point–
Density–
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Gallium-Palladium Sputtering Target Handling Notes

Indium bonding is recommended for Gallium-Palladium Sputtering Targets to address specific challenges associated with the material’s properties. Gallium-Palladium alloys exhibit characteristics such as brittleness and low thermal conductivity, which can complicate the sputtering process. Indium bonding helps mitigate these issues by enhancing the target’s thermal stability and reducing its susceptibility to thermal shock. This ensures more reliable performance and extended lifespan of the sputtering targets during use.

Gallium-Palladium Sputtering Target Application

In the fields of electronics, optics, and magnetics, Gallium-Palladium (GaPd2) Sputtering Targets are essential due to their unique properties. These targets are pivotal not only for semiconductor applications but also in the development and exploration of magnetic materials, enhancing their versatility for cutting-edge technology and high-tech applications.

Gallium-Palladium Sputtering Targets are highly valued for their adaptability across various domains. They play a critical role in thin-film deposition processes, which are fundamental for the production of high-performance electronic devices, advanced optical films, and sophisticated magnetic materials. This broad applicability highlights the significant contributions of these targets to both scientific research and industrial advancements, underscoring their importance in advancing materials science and technology.

Gallium-Palladium Sputtering Target Packaging

Our Gallium-Palladium Sputtering Target is meticulously managed throughout storage and transportation to maintain its high quality and ensure it arrives in optimal condition.

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TFM offers Gallium-Palladium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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