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ST0973 Germanium Antimony Selenium Tellurium Sputtering Target, GeSbSeTe

Chemical FormulaGeSbSeTe
Catalog No.ST0973
CAS Number
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Germanium-Antimony-Selenium-Tellurium (GeSbSeTe) sputtering targets from TFM are renowned for their superior purity and competitive pricing. Drawing on our extensive expertise in materials science, we guarantee exceptional performance and reliability, thanks to our rigorous craftsmanship and attention to detail in target production.

Introduction

Germanium Antimony Selenium Tellurium sputtering targets are multicomponent chalcogenide materials engineered for advanced thin-film deposition, particularly in phase-change memory (PCM), optoelectronics, and infrared-related research. By carefully balancing Ge–Sb–Se–Te composition, these targets enable precise tuning of optical contrast, electrical switching behavior, and thermal stability—key requirements for next-generation data storage and functional thin films.

Detailed Description

Ge–Sb–Se–Te (often abbreviated as GSTSe) belongs to the chalcogenide alloy family, where germanium and antimony form the structural backbone while selenium and tellurium tailor crystallization kinetics, bandgap, and optical response. Compared with traditional Ge–Sb–Te systems, selenium incorporation can improve thermal stability, reduce power consumption, and enhance endurance in phase-change applications.

Our Germanium Antimony Selenium Tellurium sputtering targets are fabricated from high-purity elemental precursors using controlled vacuum melting, alloy homogenization, and precision machining. Strict stoichiometric control ensures excellent compositional uniformity across the target, which is essential for repeatable sputtering rates and consistent thin-film properties.

These targets are compatible with DC magnetron sputtering and RF sputtering (depending on composition and system configuration). Planar disc targets are available in standard sizes, with optional indium or elastomer bonding to copper backing plates to improve thermal management and mechanical stability during deposition. Custom compositions and dimensions can be provided to support both research and pilot-scale production.

Applications

Germanium Antimony Selenium Tellurium sputtering targets are commonly used in:

  • Phase-change memory (PCM) and neuromorphic devices

  • Non-volatile memory and data storage research

  • Infrared and optical functional thin films

  • Chalcogenide semiconductor thin-film studies

  • Reconfigurable photonic and optical switching devices

  • Academic and industrial R&D on multicomponent chalcogenides

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialGe–Sb–Se–Te alloyDefines phase-change & optical behavior
Purity99.9% – 99.99%Minimizes defect-induced variability
CompositionCustom Ge/Sb/Se/Te ratiosTunes switching & thermal properties
Diameter1″ – 4″ (custom available)Fits standard sputtering cathodes
Thickness3 – 6 mmDetermines target lifetime
DensityHigh, alloy-controlledEnsures stable sputtering rate
Backing PlateOptional Cu (bonded)Improves heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Ge–Sb–Se–TeImproved thermal stability, tunable switchingPCM, photonics
Ge–Sb–Te (GST)Mature PCM materialData storage
Ge–SeWide bandgap chalcogenideOptical films
Sb–TeFast phase changeMemory research

FAQ

QuestionAnswer
Can the alloy composition be customized?Yes, Ge/Sb/Se/Te ratios can be tailored to your application.
Is the target suitable for DC sputtering?Yes, most compositions are compatible with DC magnetron sputtering.
Are bonded targets available?Yes, indium-bonded or elastomer-bonded options are available.
What applications use GSTSe films most?Phase-change memory, optical switching, and IR thin-film research.

Packaging

Our Germanium Antimony Selenium Tellurium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is vacuum-sealed and protected with shock-absorbing materials to prevent contamination or mechanical damage during storage and transportation.

Conclusion

Germanium Antimony Selenium Tellurium sputtering targets provide precise compositional control, stable sputtering behavior, and reliable thin-film performance for advanced phase-change and chalcogenide applications. With flexible customization and high manufacturing standards, these targets are an excellent choice for cutting-edge memory and optical device research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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