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ST0418 Germanium Dioxide Sputtering Target, GeO2

Chemical Formula: GeO2
Catalog Number: ST0418
CAS Number: 1310-53-8
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Germanium Dioxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Germanium Dioxide (GeO₂) sputtering targets are high-purity ceramic materials designed for the deposition of optical, dielectric, and semiconductor-related thin films. As an important germanium oxide compound, GeO₂ plays a critical role in infrared optics, optical fiber technology, and advanced electronic materials.

With its high refractive index, good chemical stability, and compatibility with vacuum deposition processes, GeO₂ sputtering targets are widely used in research laboratories and industrial thin-film production environments.

Detailed Description

Germanium Dioxide crystallizes in hexagonal or tetragonal forms and is typically processed into dense ceramic sputtering targets using controlled powder preparation and sintering technologies. High-density GeO₂ targets are engineered to achieve:

  • High purity levels (3N–5N depending on application)

  • Uniform microstructure and grain size

  • Low porosity for stable sputtering behavior

  • Controlled stoichiometry to ensure consistent film composition

The density and microstructural uniformity directly influence sputtering stability, deposition rate, and the optical consistency of deposited films. For demanding applications, targets can be fabricated with copper or titanium backing plates to enhance heat dissipation and minimize cracking during high-power RF sputtering.

GeO₂ is typically sputtered using RF systems due to its insulating nature. The resulting films exhibit high transparency in the visible and infrared ranges, along with a relatively high refractive index, making them suitable for optical multilayer stacks and waveguide structures.

Applications

Germanium Dioxide sputtering targets are commonly used in:

  • Optical Coatings
    High-refractive-index layers in antireflective coatings and optical filters.

  • Infrared Optics
    Thin films for IR lenses and sensor systems.

  • Optical Fiber Preforms
    Doping material for modifying refractive index profiles in fiber optics.

  • Semiconductor & Dielectric Films
    Gate dielectrics and passivation layers in specialized devices.

  • Photonic Devices
    Waveguides and integrated optical components.

  • Research & Development
    Thin-film material studies in universities and national laboratories.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaGeO₂Defines film composition
Purity99.9% – 99.999% (3N–5N)Reduces optical and electrical defects
Density≥ 95–99% theoretical densityEnsures stable sputtering behavior
Diameter1″ – 6″ (custom sizes available)Fits various sputtering cathodes
Thickness3 – 8 mmInfluences target lifetime
BondingCu or Ti backing plate optionalImproves thermal management
Sputtering TypeRF recommendedSuitable for insulating materials

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Germanium Dioxide (GeO₂)High refractive index, IR transparencyOptical & IR coatings
Silicon Dioxide (SiO₂)Low refractive index, high stabilityAntireflective layers
Titanium Dioxide (TiO₂)Very high refractive indexOptical multilayers
Hafnium Oxide (HfO₂)High dielectric constantAdvanced electronics

GeO₂ is often selected when infrared transmission and refractive index tuning are primary design considerations.

FAQ

QuestionAnswer
Is GeO₂ target suitable for DC sputtering?Due to its insulating nature, RF sputtering is generally recommended.
Can target size and thickness be customized?Yes, diameter, thickness, and bonding configuration can be tailored.
What purity level is recommended for optical applications?4N or higher purity is typically preferred for precision optical coatings.
Are bonded targets available?Yes, copper or titanium backing plates are available for improved thermal stability.
How is the product packaged?Vacuum-sealed with protective foam and export-grade cartons or wooden crates.

Packaging

Our Germanium Dioxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Germanium Dioxide (GeO₂) sputtering targets provide a reliable solution for depositing high-quality optical and dielectric films, particularly in infrared and photonic applications. With controlled purity, optimized density, and customizable configurations, GeO₂ targets support both precision research and industrial-scale thin-film production.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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