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VD0750 Germanium Nitride Evaporation Materials, Ge3N4

Catalog No.VD0750
MaterialGermanium Nitride (Ge3N4)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a leading manufacturer and supplier of high-purity Germanium Nitride evaporation materials, alongside a diverse range of other evaporation products. Our Germanium Nitride materials are available in both powder and granule forms, with customization options to meet your specific needs. Whether you require standard or tailored solutions, TFM ensures exceptional quality and reliability in every product.

MSDS File

Germanium Nitride Evaporation Materials Overview

Germanium Nitride (Ge3N4) evaporation materials from TFM are advanced nitride ceramic compounds, essential for high-quality film deposition processes. With a chemical formula of Ge3N4, these materials are known for their high purity and play a crucial role in ensuring the integrity of deposited films.

Key Specifications

Material TypeGermanium Nitride
SymbolGe3N4
Appearance/ColorLight brown
Melting Point900 °C (1,650 °F; 1,170 K) (decomposes)
Density5.25 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Germanium Nitride evaporation materials are used in various high-precision applications:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging

TFM ensures that Germanium Nitride evaporation materials are thoroughly tagged and labeled for clear identification and rigorous quality control. We take meticulous care to prevent any damage during storage and transportation.

Contact Us

As a leading supplier of high-purity Germanium Nitride evaporation materials, TFM offers products in multiple forms including tablets, granules, rods, and wires. Custom shapes and quantities can be requested to fit specific needs. Additionally, we provide a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further information on materials not listed, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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