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ST0278 Germanium Sulfide Sputtering Target, GeS

Chemical Formula: GeS
Catalog Number: ST0278
CAS Number: 12025-32-0
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Germanium Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Germanium Sulfide Sputtering Target Description

A Germanium sulfide sputtering target is a ceramic sputtering target composed of the elements germanium and sulfur, typically used in various thin film deposition processes.

GermaniumGermanium is a chemical element with the symbol “Ge” and atomic number 32. It was first identified in 1886 by the chemist Clemens Winkler, who named it after his homeland, Germany (Latin: Germania). Germanium is situated in Period 4 and Group 14 of the periodic table, falling under the p-block elements. It has a relative atomic mass of 72.64(1) Dalton, where the number in brackets represents the uncertainty in the measurement. This element is notable for its semiconductor properties and is used in electronics and optics.

Related Product: Germanium Sputtering Target

SulfurSulfur, also known as sulphur, is a chemical element with the symbol “S” and atomic number 16. The name originates from the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium,’ both referring to sulfur. This element has been known and used since ancient times, with evidence of its use dating back to before 2000 BC, particularly by Chinese and Indian civilizations. Sulfur is located in Period 3 and Group 16 of the periodic table, within the p-block. Its relative atomic mass is 32.065(5) Dalton, with the number in brackets indicating the uncertainty of the measurement. Sulfur is a key element in various industrial processes, including the production of sulfuric acid, and is also essential for life.

Germanium Sulfide Sputtering Target Application

The germanium sulfide sputtering target is utilized in a range of applications, including thin film deposition, decorative coatings, and semiconductor manufacturing. It is commonly used in the production of displays, LEDs, and photovoltaic devices. Additionally, germanium sulfide is valuable for functional coatings and is employed in the optical information storage industry, as well as for glass coatings in automotive and architectural applications. Its properties make it suitable for use in optical communication technologies and other advanced materials sectors.

Germanium Sulfide Sputtering Target Packing

Our germanium sulfide sputtering targets are meticulously tagged and labeled externally to facilitate efficient identification and ensure stringent quality control. We take great care in handling and packaging these targets to prevent any potential damage during storage or transportation, ensuring that they arrive in pristine condition.

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TFM offers Germanium Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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