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ST0016 Germanium Sputtering Target, Ge

Chemical Formula: Ge
Catalog Number: ST0016
CAS Number: 7440-56-4
Purity: >99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Germanium sputtering target come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

COA_Ge_5N

 

Germanium Sputtering Target

Introduction

Germanium Sputtering Target is a high-purity semiconductor material widely used in thin film deposition and optical coating applications. With excellent electrical properties, infrared transparency, and compatibility with various substrates, germanium is a vital material for producing infrared optics, semiconductor devices, and photovoltaic thin films. Its stable sputtering behavior ensures smooth film formation and consistent layer quality, making it an indispensable component in advanced coating systems.

Detailed Description

The Germanium Sputtering Target is made from refined germanium metal with a purity typically ranging from 99.99% (4N) to 99.999% (5N). It is processed through vacuum melting and precise machining to achieve uniform grain size, high density, and minimal oxygen contamination.

Key features include:

  • Excellent film uniformity: Enables precise control over thickness and optical properties.

  • High purity and density: Reduces impurities that could cause defects or irregularities in thin films.

  • Good thermal stability: Maintains consistent sputtering rate and adhesion under high-vacuum conditions.

  • Infrared transmission: Allows germanium-based coatings to be used in IR optical systems and detectors.

  • Customizable shapes and bonding options: Available as planar, rotary, and step targets with optional backing plates (copper or titanium) for better heat dissipation.

Applications

Germanium Sputtering Target serves in multiple industrial and research sectors, including:

  • Infrared optics: Production of IR lenses, windows, and detectors.

  • Semiconductor fabrication: Used in transistors, diodes, and integrated circuit layers.

  • Photovoltaic devices: As a key substrate or layer in thin-film solar cells.

  • Optical coatings: Anti-reflective and reflective coatings for optical instruments.

  • Research and development: Material studies and nanostructure coatings in universities and laboratories.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaGeElemental composition
Purity99.99% – 99.999%High purity ensures stable sputtering performance
Density5.323 g/cm³Influences film growth rate
Melting Point937.4 °CDetermines process temperature range
Electrical Resistivity~1.45 Ω·cmRelevant for semiconductor applications
Diameter25 – 300 mm (custom)Fits different sputtering systems
Thickness3 – 6 mmAffects sputtering rate and film uniformity
Backing PlateCopper / TitaniumImproves heat dissipation and bonding strength

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Germanium (Ge)Infrared transparency, semiconductor useOptical coatings, solar cells
Silicon (Si)Lower cost, widespread useMicroelectronics, semiconductor layers
Gallium Arsenide (GaAs)Direct bandgap for optoelectronicsLasers, LEDs, high-speed electronics

FAQ

QuestionAnswer
Can the target size be customized?Yes. We provide custom diameters, thicknesses, and bonding types according to your system specifications.
What purity levels are available?4N (99.99%) and 5N (99.999%) are standard. Higher purities can be offered upon request.
Which sputtering systems are compatible?Compatible with DC, RF, and magnetron sputtering systems.
How is it packaged?Each target is vacuum-sealed with moisture protection and cushioned in export-safe wooden crates.
What industries commonly use germanium targets?Semiconductor, optics, defense, aerospace, and energy research.
Is bonding recommended for large targets?Yes. Copper or titanium backing is suggested for improved heat conduction and structural support.

Packaging

Our Germanium Sputtering Targets are carefully packaged under inert atmosphere and vacuum-sealed to prevent oxidation. Each piece is labeled with purity, batch number, and dimensions for traceability. Protective foam and shockproof export cartons ensure safe delivery worldwide.

Conclusion

Germanium Sputtering Target offers an excellent combination of semiconductor functionality, optical clarity, and stability for advanced thin film deposition. Its high purity, consistent microstructure, and reliable sputtering behavior make it the preferred choice for both research and industrial coating applications.

For detailed specifications and quotations, please contact us at [sales@thinfilmmaterials.com].

Order Now

Germanium Target 99.999% ø50.8×3mm Indium Bonded Cu B/Plate, Ge Target 5N, ø100×3mm, Indium Bonded to 3mm Cu Backing Plate with Keeper, Germanium (Ge) Target 5N ø50.8×2mm Indium Bonded 1mm Cu B/Plate, Germanium Target, 4N , P-Type, ø5"×6mm, Germanium Target, 4N , P-Type, ø6"×6mm, Ge Target 5N, ø10×1mm, Ge target 5N ø50.8×3.18mm N-Type
Ge target 5N ø50.8×3.18mm N-Type, Ge target ø50.8×2mm Cu B/Plate, Ge target ø50.8×3mm Cu B/Plate, Ge target 4N ø2"×6.35mm, Ge target 124.85×85×2 mm 3N, Ge target 5N ø50.8×3.18 mm, Ge target 124.85×85×2 mm 5N, Ge target 5N ø50.8×3 mm Indium Bonded 3 mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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