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Gold Evaporation Materials

VD0550 Gold Evaporation Materials, Au

Material Type: Gold
Symbol: Au
Color/Appearance: Gold, Metallic
Purity: 99.9% ~ 99.999%
Shape: Powder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity gold evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, and offer customized options to meet specific needs.

 

MSDS File

Gold Evaporation Materials Description

TFM is a top manufacturer and supplier of high-purity germanium evaporation materials, offering a broad selection of other evaporation materials as well. Our products are available in powder, wire and granule forms, with customizable options to meet specific requirements.

gold evaporation materials

Gold Evaporation Materials Specification

Material TypeGold
Color/AppearanceGold, Metallic
Purity99.9% ~ 99.999%
ShapePowder / Wire / Granule/ Custom-made
Thermal Conductivity320 W/m.K
Melting Point1,064 °C
SynonymsAu Pellets, Au Pieces, Au Evaporation Pellet, Au Wire, Gold Wires, Gold Pellets, Gold Pieces, Gold Evaporation Pellet

Gold Evaporation Materials Applications

Gold evaporation materials are widely used in high-precision applications such as microelectronics, semiconductors, optical coatings, and aerospace components. Thanks to gold’s excellent conductivity, reflectivity, and resistance to oxidation, it is ideal for forming thin, uniform films in processes like PVD (Physical Vapor Deposition) and e-beam evaporation. Typical uses include circuitry in integrated chips, reflective coatings in optics, and bonding layers in MEMS and solar cell technologies.

Packaging of Gold Evaporation Materials

We take meticulous care in handling our gold evaporation pellets to avoid any damage during storage and transportation, ensuring that their quality is preserved and they remain in their original condition.

Ordering Table

Material Size Quantity Purity Part Number
Gold 1/4" Dia. x 1/4" Length per pellet 99.99% EVMAU40QXQ
Gold 1/4" Dia. x 1/4" Length per pellet 99.999% EVMAU50QXQ
Gold 1/8" Dia. x 1/8" Length per gram 99.99% EVMAUXX40G
Gold 1/8" Dia. x 1/8" Length per gram 99.999% EVMAUXX50G
Gold Up to 4 mm Pieces per gram 99.99% EVMAU40SHOT
Gold Up to 4 mm Pieces per gram 99.999% EVMAU50SHOT
Gold Up to 4mm Wires Per mm 99.999% EVMAUWTS

 

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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