Gold-Plated OFHC Copper Gaskets for ConFlat (CF) UHV Flanges
Gold-Plated OFHC Copper Gaskets for ConFlat (CF) UHV Flanges, offered by TFM, are designed to deliver exceptional performance in ultra-high vacuum (UHV) and corrosive environments. These gaskets combine the high thermal conductivity and malleability of annealed oxygen-free high conductivity (OFHC) copper with the corrosion resistance and inertness of a gold plating—making them an ideal solution for precision vacuum sealing.
Key Features
High-Purity OFHC Copper Core
The gaskets are made from oxygen-free high conductivity copper with over 99.99% purity, ensuring minimal outgassing and superior thermal conductivity.Durable Gold Plating
Each gasket is electroplated with a thin, uniform layer of gold to enhance chemical resistance, reduce oxidation, and improve the long-term stability of the vacuum seal.Reliable UHV Sealing
Gold-Plated OFHC Copper Gaskets conform easily to ConFlat (CF) flange knife edges, forming a leak-tight metal-to-metal seal compatible with pressures down to 10⁻¹¹ Torr.Excellent for Corrosive Environments
The gold plating protects the copper from corrosive gases, moisture, and other contaminants—ideal for harsh process conditions.Bakeable and High-Temperature Ready
Withstand bake-outs and thermal cycles up to 450°C in vacuum environments without loss of plating integrity.
Applications
UHV Research and Analytical Instruments
Widely used in UHV chambers for spectroscopy, electron microscopy, and surface science due to their clean sealing and resistance to corrosion.Semiconductor and Thin Film Deposition
Excellent for high-purity vacuum systems involved in sputtering, ALD, or PVD processes, where contamination must be minimized.Cryogenics and Superconducting Systems
Maintain structural and chemical stability at cryogenic temperatures while offering excellent thermal conductivity.Corrosive Process Gas Systems
Preferred in applications where standard copper gaskets may oxidize or degrade over time due to aggressive chemicals or reactive gases.Synchrotrons and Particle Accelerators
Support critical sealing performance in advanced physics environments where long-term UHV is mandatory.
Technical Specifications
Material: OFHC Copper (annealed)
Plating: Gold (thin, uniform electroplating)
Purity: Copper >99.99%
Vacuum Rating: Down to 10⁻¹¹ Torr
Temperature Tolerance: Up to 450°C
Flange Compatibility: ConFlat (CF) standard UHV flanges
Surface Finish: Smooth, burr-free edges for clean sealing
Usage: Single-use gaskets for maximum sealing integrity
Benefits of Gold-Plated OFHC Copper Gaskets
Combines softness and sealing performance of annealed copper with inert, corrosion-resistant gold coating
Reduces chemical reactivity in demanding vacuum or gas process systems
Minimizes flange contamination risk from oxidation or surface degradation
Extends the shelf life of unused gaskets in storage due to gold’s resistance to tarnish
Maintains seal quality even in repeated high-temperature bake-outs
Why Choose TFM?
TFM’s Gold-Plated OFHC Copper Gaskets for ConFlat (CF) UHV Flanges are precision-manufactured under strict quality controls to meet the rigorous standards of the scientific, industrial, and semiconductor sectors. Whether you’re working in cutting-edge physics research or maintaining high-vacuum manufacturing systems, these gaskets deliver long-term performance, chemical stability, and vacuum integrity.
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