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ST0528 Gold Platinum Sputtering Target, Au/Pt

Chemical Formula: Au/Pt
Catalog Number: ST0528
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gold Platinum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Gold Platinum Sputtering Target Description

Gold Platinum Sputtering Targets are fabricated by combining high-purity gold and platinum materials to create a homogeneous alloy. These targets are precisely machined into specific shapes for sputtering applications. The alloy composition can be customized to achieve desired properties, including specific electrical conductivity, corrosion resistance, and other specialized characteristics.

Related Products: Gold Sputtering Targets, Platinum Sputtering Targets.

Platinum

Gold

Gold Platinum Sputtering Target Specification

Material TypeGold Platinum
SymbolAu/Pt
Color/AppearanceSolid
Molecular Weight392.05
Monoisotopic Mass391.931 g/mol
Melting PointVaries based on alloy composition, typically above 1,000°C (1,832°F)
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Other alloy compositions, shapes, sizes, and purity customization are available.

Gold Platinum Sputtering Target Application

Gold-Platinum Alloy Sputtering Targets are utilized in various applications, especially within the electronics and sensor industries. These alloys provide a unique blend of properties, including superior electrical conductivity, corrosion resistance, and biocompatibility. They are commonly used to deposit thin films of gold-platinum alloys on substrates for applications such as electrical contacts, biosensors, and electrode materials in a wide range of devices.

Gold Platinum Sputtering Target Packing

Our metal alloy Gold Platinum Sputter Coater Targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to prevent any damage during storage or transportation, preserving the quality and integrity of the product.

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Gold Platinum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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