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ST0528 Gold Platinum Sputtering Target, Au/Pt

Chemical Formula: Au/Pt
Catalog Number: ST0528
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gold Platinum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Gold Platinum Sputtering Target

Introduction

The Gold Platinum Sputtering Target is a high-value material engineered for thin film deposition, combining the unique properties of two noble metals. Gold contributes excellent conductivity and chemical inertness, while platinum adds outstanding catalytic stability, high melting point, and corrosion resistance. Together, they form a versatile target material widely used in microelectronics, optics, catalysis research, and decorative coatings.

Detailed Description

Gold Platinum Sputtering Targets are typically manufactured by vacuum melting and precision machining or powder metallurgy processes to ensure homogeneity and density. The Au-Pt alloy composition can be customized depending on the application, ranging from Au-rich alloys for conductivity to Pt-rich alloys for catalytic and chemical resistance.

Key features include:

  • High Purity (99.9%–99.99%): Ensures minimal contamination during film deposition.

  • Excellent Film Adhesion: Produces uniform, dense, and stable thin films.

  • Corrosion Resistance: Both gold and platinum withstand aggressive chemical environments.

  • Customizable Composition: Tailored Au:Pt ratios for electronic, optical, or catalytic performance.

  • Thermal Stability: Platinum enhances performance under high-temperature sputtering conditions.

Applications

The Gold Platinum Sputtering Target is used across multiple industries and advanced research fields:

  • Semiconductors & Microelectronics: Thin conductive layers, barrier films, interconnects.

  • Optical Coatings: Anti-reflective, decorative, and functional coatings.

  • Catalysis Research: Fabrication of catalytic thin films for fuel cells, sensors, and hydrogenation studies.

  • Energy & Fuel Cells: Thin films for electrodes in solid oxide fuel cells and electrolyzers.

  • Jewelry & Decorative Coatings: High-value decorative layers with enhanced durability.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity ensures film performance and reliability
Composition (Au:Pt)80:20 – 20:80 (custom)Composition influences conductivity & catalytic activity
Diameter25 – 300 mm (customizable)Matches magnetron sputtering system sizes
Thickness3 – 6 mmAffects sputtering rate and deposition efficiency
BondingCopper / Molybdenum backingImproves heat transfer and mechanical stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Gold Platinum (Au-Pt)Balanced conductivity & stabilityCatalysis, optics, electronics
Pure Gold (Au)Highest conductivity, ductilityMicroelectronics, decoration
Pure Platinum (Pt)Superior catalytic activityFuel cells, chemical sensors

FAQ

QuestionAnswer
Can the Au:Pt ratio be customized?Yes, alloy composition is adjustable to meet specific electronic or catalytic requirements.
How is it packaged?Each target is vacuum-sealed, protected with foam, and shipped in export-safe cartons or crates.
What is the delivery time?Standard lead time is 3–4 weeks depending on size and composition.
Is bonding necessary?Bonding to copper or molybdenum backing plates is recommended for larger targets to improve thermal management.
Which industries use it most?Semiconductor, optics, catalysis, energy, and decorative coating industries.

Packaging

Gold Platinum Sputtering Targets are sealed in inert gas or vacuum-packed to avoid oxidation. External labeling ensures traceability with detailed information on purity, composition, dimensions, and lot number. Packaging is designed for safe international transport.

Conclusion

The Gold Platinum Sputtering Target offers a powerful combination of conductivity, catalytic performance, and durability, making it a premium choice for advanced thin film applications. Its flexibility in composition and form ensures compatibility with diverse sputtering systems and industry requirements.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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