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ST0017 Gold Sputtering Target, Au

Chemical Formula: Au
Catalog Number: ST0017
CAS Number: 7440-57-5
Purity: 99.5%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gold Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

MSDS File

Availability: 1 in stock

Gold Sputtering Target Description

Gold

The gold sputtering target has the same properties as the precious metal gold (Au). Gold, symbolized as “Au,” originates from the Anglo-Saxon word “gold” and the Latin “aurum,” meaning “glow of sunrise.” It has been used since before 6000 BC, discovered by ancient Middle Eastern civilizations. Gold’s atomic number is 79, located in Period 6 and Group 11 of the periodic table, within the d-block. Its relative atomic mass is 196.966569(4) Dalton, with the number in brackets indicating uncertainty.

Gold is renowned for its beautiful yellow luster. It is soft, dense, malleable, ductile, and an excellent conductor of heat and electricity. Deposited films of gold sputtering targets and gold evaporation materials are used as layers in the production of semiconductors, sensors, batteries, and data storage.

Gold Sputtering Target Specification

Material TypeGold
SymbolAu
Color/AppearanceGold, Metallic
Melting Point1,064°C
Density19.3 g/cm3
SputterDC
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Gold Sputtering Target Application

The gold sputtering target is used for standard scanning electron microscopy (SEM) coating, where it covers specimens with a thin conductive layer of gold. This prevents charging of specimens with an electron beam in conventional SEM mode and increases the signal-to-noise ratio.

Other applications include:

  • Physical vapor deposition (PVD) of thin films
  • Laser ablation deposition (PLD)
  • Magnetron sputtering for semiconductors, displays, LEDs, and photovoltaic devices

Gold Sputtering Target Bonding Service

Specialized bonding services for Gold Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

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Gold Sputtering Target Handling Notes

Reclaim service is available for gold sputtering material and other precious metal targets. We aim to reduce your material costs by recycling precious metals and spent targets.

Gold Sputtering Target Packing

Our Gold Sputter Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Gold Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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