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ST0487 Gold Tin Sputtering Target, Au/Sn

Chemical Formula: Au/Sn
Catalog Number: ST0487
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gold Tin sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Gold Tin Sputtering Target Description

GoldGold is a chemical element that originated from the Anglo-Saxon word gold (aurum in Latin, meaning glow of sunrise). It was early used before 6000 BC and discovered by people from the Middle East. “Au” is the canonical chemical symbol of gold. Its atomic number in the periodic table of elements is 79 with a location at Period 6 and Group 11, belonging to the d-block. The relative atomic mass of gold is 196.966569(4) Dalton, the number in the brackets indicating the uncertainty.

TinTin, also called stannum, is a chemical element that originated from the Anglo-Saxon word tin (stannum in Latin, meaning hard). It was early used in 3500 BC. “Sn” is the canonical chemical symbol of tin. Its atomic number in the periodic table of elements is 50 with location at Period 5 and Group 14, belonging to the p-block. The relative atomic mass of tin is 118.710(7) Dalton, the number in the brackets indicating the uncertainty.

Related Products: Gold Sputtering Target, Tin Sputtering Target

Gold Tin Sputtering Target Specifications

Material Type Gold Tin
Symbol Au/Sn
Color/Appearance Solid
Melting Point 2100 °C
Density N/A
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Packing

Our Gold Tin Sputtering Targets are clearly tagged and labeled for efficient identification and quality control. We take great care to prevent any damage during storage and transportation, ensuring the targets remain in excellent condition.

Get Contact

TFM offers Gold Tin Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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