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vd0551-graphite-c-evaporation-materials-1

VD0551 Graphite (C) Evaporation Materials

Catalog No.VD0551
MaterialGraphite (C)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM supplies high-purity graphite evaporation materials and is recognized as a leading manufacturer and supplier in the industry. In addition to graphite, we offer a wide range of other evaporation materials. Our products are available in powder, granule, and customized forms to meet specific requirements.

 

MSDS File

Graphite Evaporation Materials Description

High-purity graphite evaporation materials are essential for achieving superior results in deposition processes, ensuring the production of high-quality deposited films. TFM specializes in manufacturing graphite evaporation materials with purity levels reaching up to 99.999%. We employ rigorous quality assurance procedures to ensure the reliability and performance of our products.

 

graphite evaporation materials

Graphite Evaporation Materials Specifications

Material TypeCarbon
SymbolC
Color/AppearanceBlack, Non-Metallic
Melting Point3652 – 3697 °C
Boiling Point4200 °C
Density2.267 g/cm3
Thermal Conductivity140 W/m.K
Coefficient of Thermal Expansion7.1 x 10-6/K
CommentsE-beam preferred. Arc evaporation. Poor film adhesion.

Graphite Evaporation Materials Applications

Graphite is utilized in various deposition techniques, including semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). These processes are critical for producing high-quality thin films and coatings. Additionally, graphite is used in optics for applications such as wear protection, decorative coatings, and display technologies.

Graphite Evaporation Materials Packing

We handle our evaporation materials with meticulous care to prevent damage during storage and transportation, ensuring that their quality is preserved and they arrive in pristine condition.

 

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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