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ST0293 Hafnium Boride Sputtering Target, HfB2

Chemical Formula: HfB2
Catalog Number: ST0293
CAS Number: 12007-23-7
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Hafnium Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Hafnium Boride (HfB₂) Sputtering Target is an ultra-high-temperature ceramic (UHTC) material known for its exceptional hardness, high melting point, and outstanding thermal and chemical stability. With a melting point above 3000 °C and excellent electrical conductivity compared to many ceramics, HfB₂ is widely used in advanced protective coatings, aerospace materials research, and high-temperature functional films. As a sputtering target, HfB₂ enables deposition of dense boride-based thin films designed for extreme environments.

Detailed Description

Our Hafnium Boride Sputtering Targets are manufactured from high-purity HfB₂ powders using advanced consolidation and sintering techniques to achieve high density and structural uniformity. Precise control of the Hf:B ratio is critical to maintaining the diboride phase, which directly influences hardness, oxidation resistance, and electrical performance in the deposited film.

The targets exhibit a dense microstructure with minimal porosity, reducing particle ejection and ensuring stable plasma conditions during sputtering. Due to its electrical conductivity, HfB₂ can typically be used with DC sputtering systems, although RF sputtering is also compatible depending on equipment configuration. Targets are available in circular, rectangular, or custom geometries and can be supplied unbonded or bonded to copper backing plates for improved heat dissipation during high-power operation.

Applications

Hafnium Boride Sputtering Targets are widely used in demanding thin film applications, including:

  • Ultra-high-temperature protective coatings

  • Wear-resistant and hard coatings

  • Aerospace and hypersonic material research

  • Diffusion barrier and conductive ceramic layers

  • Plasma-facing and high-heat-flux components

  • Advanced boride and UHTC thin film development

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionHfB₂Determines ultra-high-temperature stability
Purity99.5% – 99.9%Minimizes impurity-related defects
Diameter25 – 200 mm (custom available)Compatible with sputtering systems
Thickness3 – 6 mmInfluences target lifetime
Density≥ 95% theoreticalImproves plasma stability
Electrical ConductivityConductive ceramicEnables DC sputtering
BondingUnbonded / Cu backing (optional)Enhances thermal management

Comparison with Related Boride Materials

MaterialKey AdvantageTypical Application
HfB₂Extreme temperature resistanceAerospace & UHT coatings
ZrB₂High melting point & oxidation resistanceThermal protection systems
TiB₂Excellent hardness & conductivityWear-resistant coatings
HfCUltra-high melting pointExtreme environment coatings

FAQ

QuestionAnswer
Is HfB₂ suitable for high-temperature coatings?Yes, it is specifically valued for ultra-high-temperature applications.
Can DC sputtering be used?Yes, HfB₂ is electrically conductive and compatible with DC sputtering.
Are custom sizes available?Yes, diameter, thickness, and bonding options can be tailored.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or crates.

Packaging

Our Hafnium Boride (HfB₂) Sputtering Targets are carefully vacuum-sealed and labeled to ensure traceability and protection against contamination. Export-grade packaging safeguards the targets during storage and international transportation.

Conclusion

Hafnium Boride (HfB₂) Sputtering Target provides a robust solution for depositing ultra-high-temperature, wear-resistant, and conductive boride thin films. With high density, controlled composition, and customizable configurations, it is well suited for aerospace, energy, and advanced materials research applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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