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Hafnium Nitride Sputtering Target

ST0213 Hafnium Nitride Sputtering Target, HfN

Chemical Formula: HfN
Catalog Number: ST0213
CAS Number: 25817-87-2
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Hafnium Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Hafnium Nitride Sputtering Target Description

Hafnium Nitride sputtering target from TFM is a nitride ceramic sputtering material with the chemical formula HfN.

HafniumHafnium is a chemical element named after Copenhagen, Denmark, known by its Latin name, Hania. It was first mentioned in 1911 and observed by G. Urbain and V. Vernadsky. The isolation of hafnium was later accomplished and announced by D. Coster and G. von Hevesy. The chemical symbol for hafnium is “Hf,” and it has an atomic number of 72. Hafnium is located in Period 6, Group 4 of the periodic table, within the d-block. The relative atomic mass of hafnium is 178.49(2) Dalton, with the number in brackets indicating the measurement uncertainty.

Related Product: Hafnium Sputtering Target

NitrogenNitrogen is a chemical element that derives its name from the Greek words ‘nitron’ and ‘genes,’ meaning nitre-forming. It was first mentioned in 1772 and observed by Daniel Rutherford. The isolation of nitrogen was also carried out and announced by Rutherford. The chemical symbol for nitrogen is “N,” and it has an atomic number of 7. Nitrogen is located in Period 2 and Group 15 of the periodic table, belonging to the p-block. The relative atomic mass of nitrogen is 14.0067(2) Dalton, with the number in brackets indicating the measurement uncertainty.

Hafnium Nitride Sputtering Target Application

The hafnium nitride sputtering target is widely utilized in various applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also essential for functional coatings, the optical information storage industry, and glass coatings, such as those used in automotive and architectural glass. Additionally, hafnium nitride is employed in optical communication systems and other high-tech fields.

Hafnium Nitride Sputtering Target Packaging

Our hafnium nitride sputtering targets are meticulously tagged and labeled externally to guarantee efficient identification and maintain quality control standards. We take extensive precautions to prevent any potential damage during storage or transportation, ensuring that the product arrives in pristine condition and retains its high quality.

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TFM offers Hafnium Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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