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hafnium-oxide

VD0688 Hafnium(IV) Oxide Evaporation Materials, HfO2

Material Type: Hafnium Oxide
Symbol: HfO2
Purity: 99.9% ~ 99.99%
Shape: Tablets/Pieces/Custom-made

TFM stands out as a premier manufacturer and supplier of high-purity hafnium(IV) oxide evaporation materials, along with an extensive range of other evaporation materials. Our offerings include both powder and granule forms, with the flexibility to provide customized solutions tailored to your specific needs.

MSDS File

Hafnium(IV) Oxide Evaporation Materials Overview

TFM offers high-purity hafnium(IV) oxide evaporation materials, characterized by the chemical formula HfO2. This off-white oxide has a density of 9.68 g/cm³ and boasts a high melting point of 2,758°C, with a vapor pressure of 10^-4 Torr at 2,500°C. Hafnium oxide is renowned for its stability and has gained prominence in recent years for its role in enhancing the performance of computer chips, contributing to faster and more efficient processors. Our high-purity hafnium(IV) oxide is crucial for deposition processes, ensuring the production of high-quality thin films. TFM specializes in producing these materials with a purity of up to 99.9995%, adhering to rigorous quality assurance standards to guarantee reliability.

Specifications

Material Type Hafnium(IV) Oxide
Form Evaporation Materials
Symbol HfO2
Color/Appearance Off–white Solid
Melting Point  2,758 °C
Density 9.68 g/cm3
Purity 99.5% ~ 99.99%
Shape Powder/ Granule/ Custom-made

Applications

Hafnium(IV) oxide evaporation materials are widely utilized in:

  • Deposition Processes: Semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD)
  • Optics: Wear protection, decorative coatings, and display technologies

Packaging

Our hafnium(IV) oxide evaporation materials are meticulously labeled and tagged for clear identification and quality control. We ensure that packaging safeguards against damage during storage and transportation.

Contact Us

TFM is your go-to source for high-purity hafnium(IV) oxide evaporation materials, available in various forms including tablets, granules, rods, and wires. We also offer customized forms and quantities to meet specific requirements. Additionally, TFM provides a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information on our products, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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