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hafnium-oxide-with-yttrium-oxide-hfo2y2o3-sputtering-target-removebg-preview

ST0515 Hafnium Oxide with Yttrium Oxide Sputtering Target, HfO2/Y2O3

Chemical Formula:HfO2/Y2O3
Catalog Number: ST0515
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Hafnium Oxide with Yttrium oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Hafnium Oxide with Yttrium Oxide Sputtering Target Description

Hafnium

Hafnium is a lustrous, silvery-gray, tetravalent transition metal that closely resembles zirconium. Predicted by Dmitri Mendeleev in 1869, it was finally identified in 1923 by Coster and Hevesy, making it the last stable element to be discovered. The name Hafnium is derived from Hafnia, the Latin name for Copenhagen, where it was discovered.

YttriumYttrium is a chemical element named after Ytterby, Sweden, where it was first mentioned in 1794 by J. Gadolin. The isolation and announcement of yttrium were accomplished by G. Mosander. Its canonical chemical symbol is “Y,” with an atomic number of 39. Yttrium is located in Period 5, Group 3 of the periodic table, and belongs to the d-block. Its relative atomic mass is 88.90585(2) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Hafnium Sputtering Target, Yttrium Sputtering Target.

Hafnium Oxide with Yttrium Oxide Sputtering Target Specifications

Material TypeHafnium Oxide with Yttrium Oxide
SymbolHfO2/Y2O3
Color/AppearanceSolid
Melting Point/
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Hafnium Oxide with Yttrium Oxide Sputtering Target Packing

Our Hafnium Oxide with Yttrium Oxide Sputtering Targets are clearly tagged and labeled to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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TFM’s hafnium oxide with yttrium oxide sputter targets are available in a range of forms, purities, sizes, and prices. We specialize in producing high-purity PVD materials with maximum density and minimal average grain sizes, ideal for semiconductor, CVD, and PVD applications in display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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