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VD0800 Hafnium(IV) Silicate Evaporation Materials, HfSi2

Catalog No.VD0800
MaterialHafnium Silicide (HfSi2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity hafnium(IV) silicate evaporation materials, alongside a broad range of other evaporation materials. We provide hafnium(IV) silicate in both powder and granule forms to suit diverse applications. Custom forms are also available to meet specific requirements upon request.

MSDS File

Hafnium(IV) Silicate Evaporation Materials Overview

Hafnium(IV) Silicate, represented by the chemical formula HfSi2, is a highly specialized ceramic material used in various evaporation processes. This material, known for its exceptional purity and quality, is essential in producing high-performance deposited films. At TFM, we focus on manufacturing Hafnium(IV) Silicate with purity levels reaching up to 99.9995%, ensuring superior reliability and performance in your applications.

Hafnium(IV) Silicate Evaporation Materials Specification

Material TypeHafnium(IV) Silicate
SymbolHfSi2
Appearance/ColorTetragonal crystal
Melting Point2,758 °C (4,996 °F; 3,031 K)
Density7.0 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Hafnium(IV) Silicate Evaporation Materials

Hafnium(IV) Silicate evaporation materials are integral to several deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are widely used in optics for applications such as wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

Our Hafnium(IV) Silicate evaporation materials are meticulously packaged to prevent damage during transit and storage. Each package is clearly labeled to facilitate easy identification and quality control.

Contact Us

TFM is a prominent manufacturer and supplier of high-purity Hafnium(IV) Silicate evaporation materials. We offer a variety of shapes, including tablets, granules, rods, and wires, with custom options available to meet specific needs. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and to inquire about materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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