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hafnium-tetrafluoride

VD0782 Hafnium Tetrafluoride Evaporation Materials, HfF4

Catalog No.VD0782
MaterialHafnium Fluoride (HfF4)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity hafnium tetrafluoride evaporation materials. Our extensive range includes various evaporation materials, available in both powder and granule forms. For those with specific needs, we also offer customization options to meet your unique requirements.

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Hafnium Tetrafluoride Evaporation Materials Overview

Hafnium tetrafluoride (HfF4) is a high-purity fluoride ceramic evaporation material, crucial for high-quality film deposition. TFM excels in providing hafnium tetrafluoride with a purity level of up to 99.9995%, ensuring top-notch performance in various deposition processes. Our quality assurance processes guarantee the reliability of our materials.

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Specifications

Material TypeHafnium Tetrafluoride
SymbolHfF4
Appearance/ColorWhite crystalline powder
Melting Point970 °C (1,780 °F; 1,240 K) (sublimes)
Density7.1 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Hafnium tetrafluoride evaporation materials are integral to several deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

They are primarily used in optics for wear protection, decorative coatings, and display technologies.

Packaging

Our hafnium tetrafluoride evaporation materials are carefully packaged with clear labeling to ensure accurate identification and quality control. We prioritize preventing any damage during storage or transport.

Contact Us

TFM offers a range of hafnium tetrafluoride evaporation materials, including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. We also provide various evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current prices and additional information, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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