Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
🔍
holmium-ho-sputtering-target-removebg-preview

ST0020 Holmium Sputtering Target, Ho

Chemical Formula: Ho
Catalog Number: ST0020
CAS Number: 7440-60-0
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Holmium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Availability: 1 in stock

Holmium Sputtering Target Description

Holmium

The holmium sputtering target is a silvery metallic target made from high-purity holmium metal. Holmium, symbolized as “Ho,” is a chemical element named after Stockholm, Sweden (Latin: Holmia). It was first mentioned in 1878 and observed by M. Delafontaine. Holmium has an atomic number of 67, located in Period 6, Group 3 of the periodic table, within the f-block. Its relative atomic mass is 164.93032(2) Dalton, with the number in brackets indicating uncertainty.

Holmium Sputtering Target Specification

Material TypeHolmium
SymbolHo
Color/AppearanceSilvery White, Metallic
Melting Point1,474°C
Density8.8 g/cc
Thermal Conductivity16 W/m.K
Coefficient of Thermal Expansion11.2 x 10-6/K
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Holmium Sputtering Target Application

  • The holmium sputtering target is used for thin film deposition. Holmium is also utilized as a dopant in glass and optical fibers.

Handling Notes

  • Bonding services for holmium sputtering targets are currently unavailable.
  • Due to its high chemical reactivity, holmium sputtering targets require oil packaging and thorough cleaning to prevent environmental reactions.

Packing

Our Holmium Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Holmium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
en en