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VD0690 Indium Gallium Zinc Oxide IGZO Evaporation Materials

Catalog No.VD0690
MaterialIndium Gallium Zinc Oxide (InGaZnOx)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier producer and supplier of high-purity Indium Gallium Zinc Oxide (IGZO) evaporation materials. Our extensive range of evaporation materials includes both powder and granule forms, with customized options available to meet specific needs. Whether you’re looking for standard or tailored solutions, TFM is committed to delivering exceptional quality and performance in every product.

 

IGZO Evaporation Materials Overview

Indium Gallium Zinc Oxide (IGZO) is a high-purity evaporation material with the chemical formula IGZO. Renowned for its essential role in deposition processes, IGZO ensures the production of high-quality films. TFM specializes in producing IGZO evaporation materials with purity levels up to 99.9995%, supported by rigorous quality assurance procedures for exceptional reliability.

Related Products: Indium Evaporation Materials, Gallium Evaporation Materials, Zinc Evaporation Materials, Oxide Ceramic Evaporation Materials

IGZO Evaporation Materials Specifications

Material TypeIndium Gallium Zinc Oxide
SymbolIGZO
Color/AppearanceWhite Solid
Melting Point850 °C
Theoretical Density 6.5 g/cm3
Purity99.5% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

  • Deposition Processes: IGZO evaporation materials are essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: They are also used in optics for wear protection, decorative coatings, and displays.

Packaging

Our IGZO evaporation materials are carefully tagged and labeled to ensure clear identification and quality control. We handle all materials with great care to prevent damage during storage and transportation.

Contact Us

TFM is a leading manufacturer and supplier of high-purity IGZO evaporation materials. We offer various forms, including tablets, granules, rods, and wires, with custom options available upon request. Additionally, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current prices and inquiries about other materials, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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