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VD0692 Indium(III) Oxide Evaporation Materials, In2O3

Catalog No.VD0692
MaterialIndium Oxide (In2O3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made
TFM is a premier manufacturer and supplier of high-purity indium(III) oxide evaporation materials, along with an extensive range of other evaporation materials. We provide these materials in both powder and granule forms, and we can accommodate custom requests to meet your specific requirements.
MSDS File
Indium(III) Oxide Evaporation Materials Overview

TFM offers high-purity indium(III) oxide evaporation materials, a critical oxide with the chemical formula In₂O₃. These materials are integral to deposition processes, ensuring the production of top-quality films. With purity levels reaching up to 99.9995%, TFM’s indium(III) oxide evaporation materials are produced using stringent quality assurance measures to guarantee consistent reliability and performance.

Related Products: Indium Evaporation Materials

Indium(III) Oxide Evaporation Materials Specification

Material TypeIndium(III) Oxide
SymbolIn2O3
Color/AppearanceYellowish odorless solid
Melting Point1,910 °C
Theoretical Density 7.179 g/cm3
Purity99.5% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications of Indium(III) Oxide Evaporation Materials

Indium(III) oxide evaporation materials from TFM are widely used in various high-tech applications, including:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Applications: Ideal for wear-resistant coatings, decorative coatings, and display technologies.

Packaging and Handling

TFM ensures that all indium(III) oxide evaporation materials are carefully tagged and labeled for easy identification and rigorous quality control. Our packaging processes are meticulously designed to prevent any damage during storage or transportation, maintaining the integrity of the materials.

Contact TFM

TFM is a trusted manufacturer and supplier of high-purity indium(III) oxide evaporation materials, offering a range of shapes such as tablets, granules, rods, and wires. We also provide custom forms and quantities based on your specific needs. Additionally, TFM supplies a comprehensive selection of related products, including evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and inquiries regarding our evaporation materials or other products, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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