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VD0862A Indium Telluride Pellet Evaporation Material (InTe)

MSDS File
Material TypeIndium Telluride
SymbolInTe
Color/Appearance
Melting Point (°C)696
Theoretical Density (g/cc)6.29
Z Ratio–
E-Beam–
Thermal Evaporation TechniquesBoat:  –
Crucible:  –
E-Beam Crucible Liner Material–
Temp. (°C) for Given Vap. Press. (Torr)–
Comments–

Indium Telluride Pellet Evaporation Material

TFM offers high-purity Indium Telluride Pellet Evaporation Material, specifically designed for thin-film deposition in infrared detection, optoelectronic, and semiconductor applications. Composed of indium (In) and tellurium (Te), this material provides unique semiconducting properties, high thermal stability, and efficient infrared absorption, making it ideal for infrared sensors, photodetectors, and optoelectronic devices.

Engineered for thermal evaporation and electron beam (E-beam) evaporation, Indium Telluride Pellet Evaporation Material ensures uniform film deposition, excellent adhesion, and superior purity, contributing to the development of high-performance thin films for advanced technological applications.

Key Features and Advantages

  • Efficient Infrared Absorption: Perfect for long-wavelength infrared (LWIR) and mid-wavelength infrared (MWIR) detectors, offering strong photoresponse in infrared applications.

  • High Carrier Mobility & Tunable Bandgap: Supports infrared optoelectronics, infrared communication, and photonic technologies with excellent electrical and optical performance.

  • High Purity & Low Contamination: Ensures uniform thin-film growth with reduced impurities, providing reliable and consistent film characteristics.

  • Excellent Thermal Stability & Chemical Resistance: Guarantees consistent performance even in demanding deposition environments and ensures high-quality thin-film formation.

  • Customizable Compositions Available: Available in a range of stoichiometries to meet specific research and industrial needs.

Applications

  • Infrared Imaging & Thermal Detection: Used in infrared cameras, night vision systems, and thermal sensors for security, aerospace, and industrial applications.

  • Optoelectronic & Photodetector Devices: Plays a crucial role in photoelectric conversion, infrared communication, and high-resolution imaging.

  • Semiconductor & Quantum Research: Ideal for quantum dot technology, advanced semiconductor devices, and nanoelectronics.

  • Thin-Film Coatings for Optics & Electronics: Essential for precision optical coatings and infrared-sensitive detectors.

Industry Impact and Customization

TFM’s Indium Telluride Pellet Evaporation Material is designed to enhance infrared detection, optoelectronic devices, and semiconductor research. With customized material compositions, high purity, and precise evaporation capabilities, we ensure superior thin-film deposition for cutting-edge infrared and photonic technologies.

With its exceptional electrical, optical, and infrared-responsive properties, TFM’s Indium Telluride Pellet Evaporation Material is a crucial material for high-performance infrared imaging, semiconductor devices, and advanced optoelectronic applications, delivering improved efficiency, reliability, and long-term performance.

Description

99.9% Purity, Diameter 3" * Thickness 1/8"

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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