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VD0555 Iridium Evaporation Materials, Ir

Material Type: Iridium
Symbol: Ir
Purity: 99.99%
Shape: Powder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity iridium evaporation materials, along with a diverse range of other evaporation materials. We provide our products in both powder and granule forms, with customization options available to meet specific needs.

MSDS File

Iridium Evaporation Materials Description

High-purity evaporation materials are essential for achieving optimal results in deposition processes, leading to the creation of high-quality deposited films. TFM specializes in manufacturing iridium evaporation materials with purity levels up to 99.99%, employing stringent quality assurance procedures to ensure the reliability and performance of our products.

iridium evaporation materials

Iridium Evaporation Materials Specification

Material TypeIridium
SymbolIr
Atomic Weight192.217
Atomic Number77
Color/AppearanceSilvery White, Metallic
Melting Point2,410°C
Theoretical Density22.42 g/cc
SynonymsIr Pellets, Ir Pieces, Ir Evaporation Pellet, Iridium Pellets, Iridium Pieces, Iridium Evaporation Pellet

Iridium Evaporation Materials Application

Iridium evaporation materials are employed in various deposition techniques, including semiconductor fabrication, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). These methods are crucial for producing high-quality thin films essential for advanced technologies. In optics, iridium materials are used for enhancing wear resistance, creating decorative coatings, and improving display technologies.

Iridium Evaporation Materials Packaging

We take great care in handling our iridium evaporation materials to avoid any damage during storage and transportation, ensuring that the quality and original condition of our products are preserved.

Ordering Table

Material UnitWeight Purity Part Number
Iridium 25g 99.9% EVMIR3036A
Iridium 50g 99.9% EVMIR3036B
Iridium 75g 99.9% EVMIR3036C
Iridium 100g 99.9% EVMIR3036D
Iridium 200g 99.9% EVMIR3036H

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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