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ST0294 Iron Boride Sputtering Target, FeB

Chemical Formula:Ā FeB
Catalog Number:Ā ST0294
CAS Number:Ā 12006-84-7
Purity:Ā 99.5%
Shape:Ā Discs, Plates, Column Targets, Step Targets, Custom-made

Iron BorideĀ  sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Iron Boride Sputtering Target Description

An Iron Boride Sputtering Target is a ceramic material composed of iron and boron, commonly used in sputtering processes. This target is utilized for thin film deposition and various specialized applications due to its distinct properties.

ironIron, also known by its Latin name “ferrum,” has the chemical symbol “Fe” and an atomic number of 26. The name “iron” originates from the Anglo-Saxon word ‘iren.’ Iron has been used by humans since before 5000 BC. It is positioned in Period 4 and Group 8 of the periodic table, belonging to the d-block elements. The relative atomic mass of iron is approximately 55.845 Daltons, with the value in parentheses indicating a margin of uncertainty.

Related Product:Ā Iron Sputtering Target

BoronBoron, with the chemical symbol “B” and atomic number 5, derives its name from the Arabic word ‘buraq,’ referring to borax. It was first identified in 1808 by chemists Louis-Joseph Gay-Lussac and Louis-Jacques ThĆ©nard. The successful isolation of boron was later achieved and announced by Sir Humphry Davy. It is located in Period 2 and Group 13 of the periodic table, within the p-block of elements. The relative atomic mass of boron is approximately 10.811 Daltons, with the number in parentheses indicating a margin of uncertainty.

Iron Boride Sputtering Target Specification

Compound FormulaFeB
AppearanceGray solid
Density7.15 g/cm3
Melting Point~1,650 Ā°C
Available SizesDia.: 1.0ā€³, 2.0ā€³, 3.0ā€³, 4.0ā€³, 5.0ā€³, 6.0ā€³
Thick: 0.125ā€³, 0.250ā€³

Iron Boride Sputtering Target Application

The Iron Boride Sputtering Target is employed in a variety of applications, including thin film deposition and decorative coatings. It is widely used in the semiconductor industry, display technologies, LED and photovoltaic device manufacturing, and functional coatings. Additionally, this material is significant in the optical information storage industry, glass coating for automotive and architectural glass, and optical communication technologies.

Iron Boride Sputtering TargetĀ Packing

Our Iron Boride Sputtering Targets are carefully tagged and labeled externally to ensure easy identification and stringent quality control. We take extensive precautions to protect these targets from any potential damage during storage and transportation, ensuring they remain in optimal condition.

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TFM offers Iron Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Itā€™s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or compositesā€”chosen based on the filmā€™s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the targetā€™s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the targetā€™s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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