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iron-carbide

VD0763 Iron Carbide (Fe3C) Evaporation Materials

Catalog No.VD0763
MaterialIron Carbide (Fe3C)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier producer and distributor of high purity Iron Carbide (Fe3C) and a diverse range of evaporation materials. Our offerings include both powder and granule forms of these materials, with custom options available to meet specific needs.

MSDS File

Iron Carbide (Fe3C) Evaporation Materials Overview

TFM provides premium Iron Carbide (Fe3C) evaporation materials, known for their high purity and reliability. With a chemical composition of Fe3C, these carbide ceramic materials are integral to deposition processes, ensuring the production of superior-quality films. Our high-purity Fe3C materials boast a purity level of up to 99.9995%, achieved through rigorous quality assurance measures to ensure consistent performance.

Specifications

Material TypeIron Carbide
SymbolFe3C
Appearance/ColorDark gray or black solid
Melting Point~1837 °C
Density7.64 kg/cu m
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Iron Carbide (Fe3C) evaporation materials are versatile and utilized in several applications, including:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Employed in wear protection, decorative coatings, and display technologies.

Packaging

Our Iron Carbide (Fe3C) evaporation materials are carefully packaged to prevent damage during storage and transit. Each package is clearly labeled to facilitate easy identification and maintain quality control.

Contact Us

TFM is committed to providing high-quality Iron Carbide (Fe3C) evaporation materials in various forms such as tablets, granules, rods, and wires. We also offer custom shapes and quantities to meet specific requirements. In addition to evaporation materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about our products, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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