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VD0556 Iron Evaporation Materials, Fe

Material Type: Iron
Symbol: Fe
Purity: 99.9% ~ 99.95%
Shape: Powder/ Granule/ Custom-made

TFM is a leading producer and supplier of high-purity iron evaporation materials, alongside a broad range of other evaporation materials. We provide our products in both powder and granule forms, with customization options available to meet specific requirements.

MSDS File

Iron Evaporation Material Description

Iron, with a melting point of 1,535°C, a density of 7.86 g/cc, and a vapor pressure of 10⁻⁴ Torr at 1,180°C, is a versatile metal widely used in various products, including tools, automobiles, and machinery. When combined with carbon, iron forms steel, a material fundamental to construction and automotive industries. Additionally, iron plays a crucial role in biological systems by transporting oxygen in the blood.

High-purity iron evaporation materials are essential for effective deposition processes, leading to the production of high-quality deposited films. TFM specializes in providing iron evaporation materials with purity levels reaching up to 99.95%, supported by stringent quality assurance procedures to ensure the reliability and performance of our products.

iron evaporation materials

Iron Evaporation Material Specification

Material TypeIron
SymbolFe
Color/AppearanceSolid
Melting Point1,535 °C
SputterDC
Density7.86 g/cc
Thermal Conductivity80 W/m.K
Coefficient of Thermal Expansion11.8 x 10-6/K
SynonymsFe Pellets, Fe Pieces, Fe Evaporation Pellet, Iron Pellets, Iron Pieces, Iron Evaporation Pellet

Iron Evaporation Material Application

Iron evaporation materials are utilized in various deposition techniques, such as semiconductor fabrication, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). These methods are crucial for producing high-quality thin films used in advanced technologies. Additionally, iron materials are employed in optics for applications including wear protection, decorative coatings, and enhancing display technologies.

Iron Evaporation Material Packaging

We meticulously handle our iron evaporation materials to avoid damage during storage and transportation, ensuring that the quality and original condition of our products are preserved.

Iron Evaporation Material Packaging

Material Size Quantity Purity Part Number
Iron 1/4" Dia. x 1/4" Length 1 lb. 99.95% EVMFE35QXQ
Iron 1/4" Dia. x 1/4" Length 25 g 99.95% EVMFE35QXQA
Iron 1/4" Dia. x 1/4" Length 50 g 99.95% EVMFE35QXQB
Iron 1/4" Dia. x 1/4" Length 100 g 99.95% EVMFE35QXQD
Iron 1/4" Dia. x 1/4" Length 200 g 99.95% EVMFE35QXQH
Iron 1/4" Dia. x 1/4" Length 1 kg 99.95% EVMFE35QXQKG
Iron 1/4" Dia. x 1/4" Length 500 g 99.95% EVMFE35QXQT
Iron 1/4" Dia. x 1/4" Length 1 lb. 99.99% EVMFE40QXQ
Iron 1/4" Dia. x 1/4" Length 50 g 99.99% EVMFE40QXQB
Iron 1/8" Dia. x 1/8" Length 1 lb. 99.95% EVMFE35EXE
Iron 1/8" Dia. x 1/8" Length 25 g 99.95% EVMFE35EXEA
Iron 1/8" Dia. x 1/8" Length 50 g 99.95% EVMFE35EXEB
Iron 1/8" Dia. x 1/8" Length 100 g 99.95% EVMFE35EXED
Iron 1/8" Dia. x 1/8" Length 250 g 99.95% EVMFE35EXEJ
Iron 1/8" Dia. x 1/8" Length 500 g 99.95% EVMFE35EXET
Iron 1/8" Dia. x 1/8" Length 100 g 99.99% EVMFE40EXED

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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