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ST0891 Iron Gallium Sputtering Target, Fe/Ga

Chemical FormulaFe/Ga
Catalog No.ST0891
CAS Number37245-77-5
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Iron Gallium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Iron Gallium Sputtering Target Description

The Iron Gallium Sputtering Target is a specialized material used in sputtering, a widely employed method for thin-film deposition. It is made from a high-purity blend of iron and gallium.

The Iron Gallium Sputtering Target is designed for applications requiring a thin film of iron-gallium alloy. This alloy possesses magnetic properties, making it suitable for use in magneto-electronics, including magnetic sensors, magnets, data storage devices, and spintronics.

Iron Gallium Sputtering Target Specifications

Compound FormulaFe/Ga
AppearanceGray metallic target
Molecular Weight140.773
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Iron Gallium Sputtering Target Handling Notes

Indium bonding is recommended for the Iron Gallium Sputtering Target because its properties, such as brittleness and low thermal conductivity, can make sputtering difficult. The material’s low thermal conductivity also makes it prone to thermal shock, so indium bonding helps enhance its performance and stability during the sputtering process.

Iron Gallium Sputtering Target Application

The Iron Gallium Sputtering Target is designed for applications that require a thin film of iron-gallium alloy. This alloy, known for its magnetic properties, is particularly suited for use in magneto-electronics, including magnetic sensors, magnets, data storage devices, and spintronics.

Iron Gallium Sputtering Target Packaging

We ensure that our Iron Gallium Sputtering Targets are meticulously handled during storage and transportation to maintain their quality and preserve them in their original condition.

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TFM offers Iron Gallium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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